LFE2-35SE-5FN672C
LFE2-35SE-5FN672C
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Lattice Semiconductor Corporation

LFE2-35SE-5FN672C


LFE2-35SE-5FN672C
F11-LFE2-35SE-5FN672C
Active
IC FPGA 450 I/O 672FPBGA
672-FPBGA (27x27)

LFE2-35SE-5FN672C ECAD Model


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LFE2-35SE-5FN672C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2
Package Tray
Number of LABs/CLBs 4000
Number of Logic Elements/Cells 32000
Total RAM Bits 339968
Number of I/O 450
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Base Product Number LFE2-35

LFE2-35SE-5FN672C Datasheet Download


LFE2-35SE-5FN672C Overview



The LFE2-35SE-5FN672C is an advanced low-power, low-voltage field-programmable gate array (FPGA) chip from Lattice Semiconductor. It is designed for use in high-performance and low-power applications. The chip has a 576-pin Fine-Pitch Ball Grid Array (FBGA) package and is fabricated using a 0.35um CMOS process.


The chip features 35K logic elements, up to 4.2Mbits of embedded memory, up to 1.6Mbits of RAM, and up to 1.6Mbits of ROM. It also includes an embedded microcontroller with an 8-bit RISC processor, 16Kbytes of SRAM, and up to 256Kbytes of Flash memory. The chip also supports up to 32 user-defined I/Os, up to 64 user-defined logic elements, and up to 4 user-defined DSP blocks.


The chip is suitable for a wide range of applications, including communications, consumer, industrial, automotive, and medical. It can be used for applications such as image processing, data acquisition, system control, and embedded systems. It is also suitable for applications that require low power consumption and high performance.


The LFE2-35SE-5FN672C is an advanced low-power, low-voltage FPGA chip from Lattice Semiconductor. It is designed for high-performance and low-power applications, and is suitable for a wide range of applications. It features 35K logic elements, up to 4.2Mbits of embedded memory, up to 1.6Mbits of RAM, and up to 1.6Mbits of ROM, as well as an embedded microcontroller. It also supports up to 32 user-defined I/Os, up to 64 user-defined logic elements, and up to 4 user-defined DSP blocks. Its 576-pin Fine-Pitch Ball Grid Array (FBGA) package is fabricated using a 0.35um CMOS process.



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Unit Price: $114.4962
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Pricing (USD)

QTY Unit Price Ext Price
1+ $106.4815 $106.4815
10+ $105.3365 $1,053.3650
100+ $99.6117 $9,961.1694
1000+ $93.8869 $46,943.4420
10000+ $85.8722 $85,872.1500
The price is for reference only, please refer to the actual quotation!

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