LCMXO2280E-3B256C
LCMXO2280E-3B256C
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Lattice Semiconductor Corporation

LCMXO2280E-3B256C


LCMXO2280E-3B256C
F11-LCMXO2280E-3B256C
Active
IC FPGA 211 I/O 256CABGA
256-CABGA (14x14)

LCMXO2280E-3B256C ECAD Model


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LCMXO2280E-3B256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series MachXO
Package Tray
Number of LABs/CLBs 285
Number of Logic Elements/Cells 2280
Total RAM Bits 28262
Number of I/O 211
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LFBGA, CSPBGA
Supplier Device Package 256-CABGA (14x14)
Base Product Number LCMXO2280

LCMXO2280E-3B256C Datasheet Download


LCMXO2280E-3B256C Overview



The LCMXO2280E-3B256C is a high-performance, low-power Field Programmable Gate Array (FPGA) chip model from Lattice Semiconductor. It is based on the MachXO2 family of FPGAs and is designed for use in embedded applications.


The LCMXO2280E-3B256C has a total of 256Kbits of embedded block RAM and up to 4,096 logic cells. It has a total of 26 I/O pins and is capable of operating at speeds of up to 200MHz. It has an integrated oscillator and PLL, as well as a JTAG port for programming and debugging.


The chip also features advanced power-saving features, such as dynamic voltage scaling, power-down modes and clock gating. It is also equipped with an on-chip temperature sensor, allowing for temperature monitoring and control.


The LCMXO2280E-3B256C is suitable for a wide range of applications, including automotive systems, industrial automation, medical devices, consumer electronics and more. It is available in a variety of packages, including TQFP, VQFN and BGA.


In summary, the LCMXO2280E-3B256C is a high-performance, low-power FPGA chip model from Lattice Semiconductor. It features a wide range of features, such as embedded block RAM, I/O pins, advanced power-saving features and more, making it suitable for a variety of applications.



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