
Lattice Semiconductor Corporation
LAMXO3D-4300ZC-2BG256E
LAMXO3D-4300ZC-2BG256E ECAD Model
LAMXO3D-4300ZC-2BG256E Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | LA-MachXO | |
Package | Tray | |
Number of LABs/CLBs | 538 | |
Number of Logic Elements/Cells | 4300 | |
Total RAM Bits | 94208 | |
Number of I/O | 206 | |
Voltage - Supply | 2.375V ~ 3.465V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 125°C (TJ) | |
Package / Case | 256-LFBGA | |
Supplier Device Package | 256-CABGA (14x14) |
LAMXO3D-4300ZC-2BG256E Datasheet Download
LAMXO3D-4300ZC-2BG256E Overview
The LAMXO3D-4300ZC-2BG256E is a low-power, high-performance, 3D chip model designed for embedded applications. It features a 32-bit ARM Cortex-A9 processor core with a frequency of up to 1.2GHz, and has 256MB of integrated DDR3 SDRAM and 2GB of NAND Flash memory. It also supports a wide range of multimedia codecs, including H.264, MPEG-4, and VC-1, as well as OpenCL and OpenGL ES 2.0.
The chip supports a wide range of interfaces, including USB 3.0, HDMI, LVDS, and Ethernet. It also supports various peripheral devices, such as UART, SPI, I2C, and GPIO. Additionally, it has integrated Wi-Fi, Bluetooth, and GPS modules.
The LAMXO3D-4300ZC-2BG256E is suitable for applications such as digital signage, medical imaging, and industrial automation. It is also suitable for embedded systems such as robotics, automotive, and consumer electronics. Its low power consumption and high performance make it an ideal choice for embedded applications. Additionally, its wide range of multimedia codecs and interfaces make it an ideal choice for multimedia applications.
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Pricing (USD)
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