LAMXO3D-4300ZC-2BG256E
LAMXO3D-4300ZC-2BG256E
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Lattice Semiconductor Corporation

LAMXO3D-4300ZC-2BG256E


LAMXO3D-4300ZC-2BG256E
F11-LAMXO3D-4300ZC-2BG256E
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IC FPGA 206 I/O 256CABGA
256-CABGA (14x14)

LAMXO3D-4300ZC-2BG256E ECAD Model


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LAMXO3D-4300ZC-2BG256E Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series LA-MachXO
Package Tray
Number of LABs/CLBs 538
Number of Logic Elements/Cells 4300
Total RAM Bits 94208
Number of I/O 206
Voltage - Supply 2.375V ~ 3.465V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 256-LFBGA
Supplier Device Package 256-CABGA (14x14)

LAMXO3D-4300ZC-2BG256E Datasheet Download


LAMXO3D-4300ZC-2BG256E Overview



The LAMXO3D-4300ZC-2BG256E is a low-power, high-performance, 3D chip model designed for embedded applications. It features a 32-bit ARM Cortex-A9 processor core with a frequency of up to 1.2GHz, and has 256MB of integrated DDR3 SDRAM and 2GB of NAND Flash memory. It also supports a wide range of multimedia codecs, including H.264, MPEG-4, and VC-1, as well as OpenCL and OpenGL ES 2.0.


The chip supports a wide range of interfaces, including USB 3.0, HDMI, LVDS, and Ethernet. It also supports various peripheral devices, such as UART, SPI, I2C, and GPIO. Additionally, it has integrated Wi-Fi, Bluetooth, and GPS modules.


The LAMXO3D-4300ZC-2BG256E is suitable for applications such as digital signage, medical imaging, and industrial automation. It is also suitable for embedded systems such as robotics, automotive, and consumer electronics. Its low power consumption and high performance make it an ideal choice for embedded applications. Additionally, its wide range of multimedia codecs and interfaces make it an ideal choice for multimedia applications.



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