LAE3-35EA-6FN672E
LAE3-35EA-6FN672E
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Lattice Semiconductor Corporation

LAE3-35EA-6FN672E


LAE3-35EA-6FN672E
F11-LAE3-35EA-6FN672E
Active
IC FPGA 310 I/O 672FPBGA
672-FPBGA (27x27)

LAE3-35EA-6FN672E ECAD Model


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LAE3-35EA-6FN672E Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series LA-ECP3
Package Tray
Number of LABs/CLBs 4125
Number of Logic Elements/Cells 33000
Total RAM Bits 1358848
Number of I/O 310
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Base Product Number LAE3-35

LAE3-35EA-6FN672E Datasheet Download


LAE3-35EA-6FN672E Overview



The LAE3-35EA-6FN672E is an advanced System-on-Chip (SoC) model from NXP Semiconductors. It is suitable for a wide range of applications, such as industrial automation, consumer electronics, and automotive applications. This model offers a high-performance, low-power solution for embedded systems.


The LAE3-35EA-6FN672E is an ARM Cortex-M4-based SoC that features an integrated 32-bit ARM Cortex-M4 processor with a frequency of up to 200 MHz. It also includes an integrated NXP FlexBus and NXP FlexIO peripherals, as well as an integrated NXP CoreLink DMA controller. The SoC is available in a 6x6mm BGA package and is pin-compatible with the NXP LPC11C24 and NXP LPC11C24A series.


The LAE3-35EA-6FN672E offers a wide range of features and peripherals for embedded applications. It includes an integrated USB 2.0 On-The-Go (OTG) controller, 10/100 Ethernet MAC, and an integrated NXP CoreLink DMA controller. It also includes an integrated NXP FlexBus and NXP FlexIO peripherals, as well as an integrated NXP CoreLink DMA controller. Additionally, it features an integrated NXP Power Management Unit (PMU) and an integrated NXP Secure Digital Host Controller Interface (SDHCI) for secure storage.


The LAE3-35EA-6FN672E is suitable for a wide range of applications, such as industrial automation, consumer electronics, and automotive applications. It provides a low-power solution for embedded systems with its integrated ARM Cortex-M4 processor and a wide range of peripherals. The SoC is available in a 6x6mm BGA package and is pin-compatible with the NXP LPC11C24 and NXP LPC11C24A series.



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Unit Price: $72.7669
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $67.6732 $67.6732
10+ $66.9455 $669.4555
100+ $63.3072 $6,330.7203
1000+ $59.6689 $29,834.4290
10000+ $54.5752 $54,575.1750
The price is for reference only, please refer to the actual quotation!

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