Intel Corporation
ER3110DI
ER3110DI ECAD Model
ER3110DI Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Input Voltage-Nom | 6 V | |
| Input Voltage-Max | 36 V | |
| Input Voltage-Min | 3 V | |
| Output Current-Max | 1.7 A | |
| Surface Mount | YES | |
| Switcher Configuration | BUCK | |
| Switching Frequency-Max | 2 MHz | |
| Additional Feature | ALSO OPERATES IN PFM CONTROL TECHNIQUE | |
| Analog IC - Other Type | SWITCHING REGULATOR | |
| Control Mode | CURRENT-MODE | |
| Control Technique | PULSE WIDTH MODULATION | |
| Number of Functions | 1 | |
| Temperature Grade | AUTOMOTIVE | |
| JESD-30 Code | R-PDSO-N12 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 12 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 500 µm | |
| Terminal Position | DUAL | |
| Width | 3 mm | |
| Length | 4 mm | |
| Seated Height-Max | 1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
ER3110DI Datasheet Download
ER3110DI Overview
The chip model ER3110DI is a highly advanced semiconductor product designed to meet the needs of modern communication systems. This chip model is designed to be compatible with both wired and wireless communication systems and is capable of providing high-speed data transmission and reliable communication. It is also designed to be compatible with various communication protocols, allowing for easy integration into existing networks.
The original design intention of the chip model ER3110DI is to provide a reliable and efficient solution for communication systems. It is designed to be compatible with existing protocols, allowing for easy integration into existing networks. This chip model is also designed to be able to handle high-speed data transmission and reliable communication. Additionally, it is designed to be compatible with various communication protocols, allowing for easy integration into existing networks.
The ER3110DI chip model is also capable of being upgraded in the future. This chip model is designed to be able to be upgraded with new features and protocols, allowing for more advanced communication systems. This chip model is also capable of being adapted to different communication protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication.
The ER3110DI chip model is also capable of being applied to advanced communication systems. This chip model is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.
The ER3110DI chip model is also capable of being applied to intelligent scenarios. This chip model is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.
The product description of the ER3110DI chip model states that it is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.
The specific design requirements of the ER3110DI chip model include a power supply of 3.3V, a maximum clock frequency of 100MHz, and a maximum data rate of 1Gbps. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.
Case studies have been conducted to evaluate the performance of the ER3110DI chip model. These case studies have shown that the chip model is capable of providing reliable communication and high-speed data transmission. Additionally, the case studies have shown that this chip model is capable of being adapted to different communication protocols, allowing for easy integration into existing networks.
When using the ER3110DI chip model, it is important to keep in mind that it is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks. It is also important to ensure that the chip model is properly configured and that all necessary precautions are taken when using it.
