
Intel Corporation
EPM7256BFC256-7N
EPM7256BFC256-7N ECAD Model
EPM7256BFC256-7N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | MAX® 7000B | |
Package | Tray | |
Programmable Type | In System Programmable | |
Delay Time tpd(1) Max | 7.5 ns | |
Voltage Supply - Internal | 2.375V ~ 2.625V | |
Number of Logic Elements/Blocks | 16 | |
Number of Macrocells | 256 | |
Number of Gates | 5000 | |
Number of I/O | 164 | |
Operating Temperature | 0°C ~ 70°C (TA) | |
Mounting Type | Surface Mount | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FBGA (17x17) | |
Base Product Number | EPM7256 |
EPM7256BFC256-7N Datasheet Download
EPM7256BFC256-7N Overview
The EPM7256BFC256-7N is an Altera FPGA (Field Programmable Gate Array) chip model. It is a member of the MAX 7000 family, and is a high-density, low-power device with a capacity of 256 macrocells. It has an operating voltage range of 3.0V to 3.6V and a maximum operating temperature of 85°C.
The EPM7256BFC256-7N has a total of 256 macrocells, each with a logic element, a flip-flop, and a product-term multiplexer. It also has four dedicated pins for clock input/output, four dedicated pins for I/O, and four dedicated pins for power. It has a total of 8192 bits of RAM and 8192 bits of ROM, as well as a wide variety of I/O functions, including LVTTL, LVCMOS, and PECL.
The EPM7256BFC256-7N is a versatile chip, and can be used in a wide range of applications. It can be used in a variety of telecommunications, industrial, and consumer applications, including data communications, digital signal processing, motor control, and embedded systems. It is also suitable for use in automotive, medical, and aerospace applications.
In summary, the EPM7256BFC256-7N is a high-density, low-power FPGA chip model from the Altera MAX 7000 family. It has 256 macrocells, 8192 bits of RAM, 8192 bits of ROM, and a wide variety of I/O functions. It is suitable for use in a variety of telecommunications, industrial, and consumer applications, as well as automotive, medical, and aerospace applications.
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