EPF10K50SFC256-3
EPF10K50SFC256-3
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rohs

Intel Corporation

EPF10K50SFC256-3


EPF10K50SFC256-3
F18-EPF10K50SFC256-3
Active
IC FPGA 191 I/O 256FBGA
256-FBGA (17x17)

EPF10K50SFC256-3 ECAD Model


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EPF10K50SFC256-3 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 500 ps
Number of Inputs 191
Number of Outputs 191
Number of Logic Cells 2880
Number of I/O Lines 191
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 191 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

EPF10K50SFC256-3 Overview



The chip model EPF10K50SFC256-3 is a state-of-the-art microchip that has been designed for a wide range of applications. It has a number of advantages over other microchips, including its low power consumption, high performance, and cost-effectiveness. This makes it a great choice for applications that require high performance and low power consumption.


The EPF10K50SFC256-3 is a highly integrated device, combining a number of different functions into one chip. It includes a programmable logic array (PLA), a digital signal processor (DSP), and a field programmable gate array (FPGA). This combination of components allows the chip to be used in a variety of applications, from embedded systems to medical devices.


In terms of industry trends, the EPF10K50SFC256-3 is expected to see increased demand in the near future. This is due to the increasing need for high performance and low power consumption in many applications. The chip is also expected to be used in a variety of new applications, as its integration of components makes it well-suited for a wide range of applications.


In terms of product description, the EPF10K50SFC256-3 is a highly integrated device designed for a wide range of applications. It has a number of features, including an on-chip memory controller, a timer, and an interrupt controller. It also includes a number of different I/O interfaces, such as USB, Ethernet, and CAN. These features make it suitable for a variety of applications, from embedded systems to medical devices.


In terms of design requirements, the EPF10K50SFC256-3 has been designed to meet the needs of a variety of applications. It has been designed to be cost-effective and to consume low power. It has also been designed to be highly reliable and to have a long life cycle. The chip also has a number of different features that make it suitable for a wide range of applications, from embedded systems to medical devices.


In terms of case studies, the EPF10K50SFC256-3 has been used in a number of different applications. For example, it has been used in medical devices, such as patient monitoring systems, and in embedded systems, such as industrial automation systems. In each of these applications, the chip has been found to be reliable and to provide the necessary performance and power consumption.


Finally, in terms of precautions, it is important to ensure that the application environment is suitable for the EPF10K50SFC256-3. This includes ensuring that the chip is compatible with the necessary software and hardware components. It is also important to ensure that the chip is properly configured and that the necessary safety protocols are in place.


Overall, the chip model EPF10K50SFC256-3 is a great choice for a wide range of applications. It has a number of advantages, such as its low power consumption, high performance, and cost-effectiveness. It is also expected to see increased demand in the near future, as its integration of components makes it well-suited for a variety of applications. Finally, it is important to ensure that the application environment is suitable for the chip and that the necessary safety protocols are in place.



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