EPM1270GF256C3
EPM1270GF256C3
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Intel Corporation

EPM1270GF256C3


EPM1270GF256C3
F18-EPM1270GF256C3
Active
IC CPLD 980MC 6.2NS 256FBGA
256-FBGA (17x17)

EPM1270GF256C3 ECAD Model


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EPM1270GF256C3 Attributes


Type Description Select
Mfr Intel
Series MAX® II
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 6.2 ns
Voltage Supply - Internal 1.71V ~ 1.89V
Number of Logic Elements/Blocks 1270
Number of Macrocells 980
Number of I/O 212
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number EPM1270

EPM1270GF256C3 Datasheet Download


EPM1270GF256C3 Overview



The EPM1270GF256C3 is a low-cost, low-power, high-performance field programmable gate array (FPGA) designed by Altera Corporation. It is a member of the MAX II family of FPGAs and is based on the MAX II architecture. It has a total of 256 logic elements, up to 256Kbits of embedded memory, and up to 8Kbits of user-programmable I/O pins. It also features a 5.0V tolerant I/O, a 2.5V core voltage, and a high-speed differential clock network.


The EPM1270GF256C3 is suitable for a wide range of applications, from consumer electronics to industrial automation. It is an ideal choice for applications that require high-speed, low-power, and high-density logic. It can be used in applications such as digital signal processing, image processing, motor control, and communication systems. It is also suitable for applications that require fast reconfiguration and low-cost implementation.


The EPM1270GF256C3 is a low-cost, high-performance FPGA that offers a wide range of features and capabilities. It is designed to provide the highest performance, lowest power, and highest density of any FPGA in its class. It is also designed to provide a wide range of I/O capabilities, including LVDS, LVCMOS, and SSTL I/O standards. It is also highly configurable and can be used for a wide range of applications.



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