
Intel Corporation
EPF81500ARC240-2
EPF81500ARC240-2 ECAD Model
EPF81500ARC240-2 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 1.7 ns | |
Number of Inputs | 181 | |
Number of Outputs | 177 | |
Number of Logic Cells | 1296 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 181 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 181 I/O | |
Additional Feature | 1296 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
Clock Frequency-Max | 417 MHz | |
Output Function | REGISTERED | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | HQFP240,1.37SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | FQFP, HQFP240,1.37SQ,20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | QFP | |
Pin Count | 240 |
EPF81500ARC240-2 Overview
The chip model EPF81500ARC240-2 is an FPGA chip designed and manufactured by Altera Corporation. It is a low-power, high-performance device that is ideal for applications requiring low-cost and low-power consumption. This chip model is designed to meet the needs of a wide range of applications, including embedded systems, digital signal processing, and industrial automation.
The chip model EPF81500ARC240-2 has several advantages over other FPGA models. It has a low power consumption, making it ideal for battery-powered applications. It also features high-speed signal processing, which makes it suitable for high-speed data transfer. Additionally, it has built-in support for multiple clock domains, which makes it suitable for applications that require multiple clock signals.
The chip model EPF81500ARC240-2 also has a high level of flexibility. It can be used in a variety of applications, including embedded systems, digital signal processing, and industrial automation. Additionally, it can be used in a wide range of process technologies, including CMOS, BiCMOS, and BiCMOS/CMOS. This makes it ideal for use in a wide range of applications.
The chip model EPF81500ARC240-2 is expected to be in high demand in the future. This is due to its low power consumption, high-speed signal processing, and flexibility. Additionally, the chip model is expected to be used in a variety of applications, including embedded systems, digital signal processing, and industrial automation.
When considering the application environment for the chip model EPF81500ARC240-2, it is important to consider the specific technologies that will be required. This includes considerations such as the type of processor, memory, and other components that will be needed. Additionally, it is important to consider the specific design requirements of the chip model and the actual case studies that have been conducted. This will help to ensure that the chip model is suitable for the application environment.
In conclusion, the chip model EPF81500ARC240-2 is a low-power, high-performance FPGA chip designed and manufactured by Altera Corporation. It has several advantages over other FPGA models, including low power consumption, high-speed signal processing, and flexibility. It is expected to be in high demand in the future due to its low power consumption, high-speed signal processing, and flexibility. When considering the application environment for the chip model, it is important to consider the specific technologies that will be required, as well as the specific design requirements and actual case studies that have been conducted.
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