EPF6024ATC144-2
EPF6024ATC144-2
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rohs

Intel Corporation

EPF6024ATC144-2


EPF6024ATC144-2
F18-EPF6024ATC144-2
Active
LOADABLE PLD, CMOS, TQFP-144
TQFP-144

EPF6024ATC144-2 ECAD Model


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EPF6024ATC144-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 117
Number of Outputs 117
Number of Logic Cells 1960
Number of Dedicated Inputs 4
Number of I/O Lines 117
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 117 I/O
Additional Feature CAN ALSO BE USED 24000 LOGIC GATES
Clock Frequency-Max 153 MHz
Output Function MACROCELL
Power Supplies 2.5/3.3,3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 144
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP144,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 20 mm
Length 20 mm
Seated Height-Max 1.6 mm
Ihs Manufacturer INTEL CORP
Package Description TQFP-144
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF6024ATC144-2 Datasheet Download


EPF6024ATC144-2 Overview



The EPF6024ATC144-2 chip model is a high-performance, low-power integrated circuit (IC) developed by the semiconductor manufacturer, NXP. It is designed to be used in a variety of communication systems, such as wireless, satellite, and digital radio. The chip model is based on a low-power CMOS process, making it ideal for applications that require minimal power consumption.


The EPF6024ATC144-2 chip model offers a number of advantages over other ICs, including its small size, high performance, and low power consumption. The chip model is designed to be highly compatible with a range of communication systems, providing reliable connection and data transfer. Furthermore, the chip model is designed to be highly resistant to interference, making it suitable for use in systems with high levels of interference.


The EPF6024ATC144-2 chip model is expected to remain in demand in the future, as communication systems continue to evolve. The chip model is designed to be highly compatible with the latest communication systems, making it suitable for use in a wide range of applications. As communication systems become more complex, the EPF6024ATC144-2 chip model is well positioned to meet the demands of the market.


The design of the EPF6024ATC144-2 chip model is based on a low-power CMOS process, which is highly efficient and reliable. The design includes a number of features that make the chip model suitable for use in a variety of communication systems, such as low power consumption, high performance, and resistance to interference. Furthermore, the chip model is designed to be upgradable and can be used in advanced communication systems.


The product description of the EPF6024ATC144-2 chip model includes a number of features, such as its small size, high performance, low power consumption, and resistance to interference. Furthermore, the chip model is designed to be highly compatible with a range of communication systems, providing reliable connection and data transfer. In addition, the chip model is designed to be upgradable and can be used in advanced communication systems.


In order to ensure the proper functioning of the EPF6024ATC144-2 chip model, it is important to adhere to the specific design requirements. For example, the chip model must be properly mounted and connected to the system, as incorrect installation can lead to malfunction. Furthermore, it is important to ensure that the chip model is powered correctly, as improper power supply can also lead to malfunction.


The EPF6024ATC144-2 chip model has been successfully used in a number of communication systems, including wireless, satellite, and digital radio. In these applications, the chip model has proven to be highly reliable and efficient, providing reliable connection and data transfer. Furthermore, the chip model has proven to be highly resistant to interference, making it suitable for use in systems with high levels of interference.


In conclusion, the EPF6024ATC144-2 chip model is a high-performance, low-power integrated circuit developed by NXP. The chip model offers a number of advantages, including its small size, high performance, low power consumption, and resistance to interference. Furthermore, the chip model is designed to be highly compatible with a range of communication systems, providing reliable connection and data transfer. The chip model is expected to remain in demand in the future, as communication systems continue to evolve. Finally, the chip model is designed to be upgradable and can be used in advanced communication systems.



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Unit Price: $26.7564
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Pricing (USD)

QTY Unit Price Ext Price
1+ $24.8835 $24.8835
10+ $24.6159 $246.1589
100+ $23.2781 $2,327.8068
1000+ $21.9402 $10,970.1240
10000+ $20.0673 $20,067.3000
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