Intel Corporation
EPF6024ATC144-2
EPF6024ATC144-2 ECAD Model
EPF6024ATC144-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 117 | |
| Number of Outputs | 117 | |
| Number of Logic Cells | 1960 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 117 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 117 I/O | |
| Additional Feature | CAN ALSO BE USED 24000 LOGIC GATES | |
| Clock Frequency-Max | 153 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | TQFP-144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF6024ATC144-2 Datasheet Download
EPF6024ATC144-2 Overview
The EPF6024ATC144-2 chip model is a high-performance, low-power integrated circuit (IC) developed by the semiconductor manufacturer, NXP. It is designed to be used in a variety of communication systems, such as wireless, satellite, and digital radio. The chip model is based on a low-power CMOS process, making it ideal for applications that require minimal power consumption.
The EPF6024ATC144-2 chip model offers a number of advantages over other ICs, including its small size, high performance, and low power consumption. The chip model is designed to be highly compatible with a range of communication systems, providing reliable connection and data transfer. Furthermore, the chip model is designed to be highly resistant to interference, making it suitable for use in systems with high levels of interference.
The EPF6024ATC144-2 chip model is expected to remain in demand in the future, as communication systems continue to evolve. The chip model is designed to be highly compatible with the latest communication systems, making it suitable for use in a wide range of applications. As communication systems become more complex, the EPF6024ATC144-2 chip model is well positioned to meet the demands of the market.
The design of the EPF6024ATC144-2 chip model is based on a low-power CMOS process, which is highly efficient and reliable. The design includes a number of features that make the chip model suitable for use in a variety of communication systems, such as low power consumption, high performance, and resistance to interference. Furthermore, the chip model is designed to be upgradable and can be used in advanced communication systems.
The product description of the EPF6024ATC144-2 chip model includes a number of features, such as its small size, high performance, low power consumption, and resistance to interference. Furthermore, the chip model is designed to be highly compatible with a range of communication systems, providing reliable connection and data transfer. In addition, the chip model is designed to be upgradable and can be used in advanced communication systems.
In order to ensure the proper functioning of the EPF6024ATC144-2 chip model, it is important to adhere to the specific design requirements. For example, the chip model must be properly mounted and connected to the system, as incorrect installation can lead to malfunction. Furthermore, it is important to ensure that the chip model is powered correctly, as improper power supply can also lead to malfunction.
The EPF6024ATC144-2 chip model has been successfully used in a number of communication systems, including wireless, satellite, and digital radio. In these applications, the chip model has proven to be highly reliable and efficient, providing reliable connection and data transfer. Furthermore, the chip model has proven to be highly resistant to interference, making it suitable for use in systems with high levels of interference.
In conclusion, the EPF6024ATC144-2 chip model is a high-performance, low-power integrated circuit developed by NXP. The chip model offers a number of advantages, including its small size, high performance, low power consumption, and resistance to interference. Furthermore, the chip model is designed to be highly compatible with a range of communication systems, providing reliable connection and data transfer. The chip model is expected to remain in demand in the future, as communication systems continue to evolve. Finally, the chip model is designed to be upgradable and can be used in advanced communication systems.
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5,015 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $24.8835 | $24.8835 |
| 10+ | $24.6159 | $246.1589 |
| 100+ | $23.2781 | $2,327.8068 |
| 1000+ | $21.9402 | $10,970.1240 |
| 10000+ | $20.0673 | $20,067.3000 |
| The price is for reference only, please refer to the actual quotation! | ||