Intel Corporation
EPF6024ABC256-2
EPF6024ABC256-2 ECAD Model
EPF6024ABC256-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 218 | |
| Number of Outputs | 218 | |
| Number of Logic Cells | 1960 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 218 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 218 I/O | |
| Additional Feature | CAN ALSO BE USED 24000 LOGIC GATES | |
| Clock Frequency-Max | 153 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256(UNSPEC) | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA-256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF6024ABC256-2 Datasheet Download
EPF6024ABC256-2 Overview
The chip model EPF6024ABC256-2 is a cutting-edge technology in the semiconductor industry, with a wide range of applications in various industries. As the world's leading chip model, EPF6024ABC256-2 has a variety of advantages over traditional chip models. It has a high integration level, low power consumption, low cost, and a wide range of applications.
In the near future, the demand for EPF6024ABC256-2 will increase significantly as the technology continues to evolve and more industries begin to adopt the chip model. The chip model is expected to be widely used in the automotive, industrial, and consumer electronics industries, as well as in the development of intelligent robots.
The chip model EPF6024ABC256-2 can provide a great deal of support for the development and popularization of intelligent robots. It is equipped with advanced features such as high-speed processing, low-power consumption, and high-integration, which are essential for the development of intelligent robots. In addition, the chip model is also compatible with a wide range of operating systems and programming languages, making it easier to use and develop.
In order to use the chip model EPF6024ABC256-2 effectively, certain technical talents are required. These include knowledge of microprocessors, embedded systems, and computer programming. In addition, knowledge of robotic programming and artificial intelligence is also necessary for the development of intelligent robots.
Overall, the chip model EPF6024ABC256-2 is an advanced technology that is expected to be widely used in various industries in the near future. It has a wide range of advantages over traditional chip models and can provide a great deal of support for the development and popularization of intelligent robots. In order to use the chip model effectively, certain technical talents are required, including knowledge of microprocessors, embedded systems, computer programming, robotic programming, and artificial intelligence.
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3,991 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||