Intel Corporation
EPF6016AFC100-1
EPF6016AFC100-1 ECAD Model
EPF6016AFC100-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 81 | |
| Number of Outputs | 81 | |
| Number of Logic Cells | 1320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 81 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 81 I/O | |
| Clock Frequency-Max | 172 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA100,10X10,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm | |
| Length | 11 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA100,10X10,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF6016AFC100-1 Datasheet Download
EPF6016AFC100-1 Overview
The EPF6016AFC100-1 chip model is a high-performance digital signal processor, embedded processor, and image processor. It is well suited for advanced digital signal processing and image processing applications. The chip model utilizes HDL language, which is a hardware description language that allows for the design of digital circuits. This language is used to create a hardware model of the chip's architecture and behavior.
The EPF6016AFC100-1 chip model is designed with the latest technology and industry trends in mind. It is capable of handling complex digital signal processing and image processing tasks with ease. The chip model also provides low power consumption, which is beneficial for battery-powered devices. The chip model is also designed to be compatible with existing industry standards, making it easier to integrate into existing systems.
The EPF6016AFC100-1 chip model is expected to be in high demand in the future. With the rapid advancement of technology, the chip model is designed to be able to handle more complex tasks and is expected to be more widely used in the coming years. The chip model also offers a cost-effective solution for digital signal processing and image processing applications.
The EPF6016AFC100-1 chip model offers a number of advantages for its users. It is designed to be compatible with existing industry standards, making it easier to integrate into existing systems. It also provides low power consumption, which is beneficial for battery-powered devices. Additionally, the chip model is designed to be able to handle more complex tasks, making it suitable for advanced digital signal processing and image processing applications.
The EPF6016AFC100-1 chip model is expected to be in high demand in the future. With the rapid advancement of technology, the chip model is designed to be able to handle more complex tasks and is expected to be more widely used in the coming years. Additionally, the chip model offers a cost-effective solution for digital signal processing and image processing applications. As a result, the demand for the chip model is expected to increase significantly in the near future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||