Intel Corporation
EPF6010AFC100-3
EPF6010AFC100-3 ECAD Model
EPF6010AFC100-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 880 | |
| Combinatorial Delay of a CLB-Max | 2.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 880 CLBS, 10000 GATES | |
| Clock Frequency-Max | 133 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm | |
| Length | 11 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF6010AFC100-3 Overview
The chip model EPF6010AFC100-3 is a highly advanced integrated circuit that can be used for a variety of applications. It is capable of providing high-speed data processing and networking capabilities, as well as a wide range of other features. It is one of the most popular models in the chip industry and is widely used in many different devices and systems.
The chip model EPF6010AFC100-3 is a very versatile model that can be used in many different applications. It is capable of providing a wide range of functions, from basic data processing and networking capabilities to more advanced features such as artificial intelligence and machine learning. This makes it ideal for use in the development of next-generation intelligent systems.
In terms of industry trends, the chip model EPF6010AFC100-3 is likely to remain popular in the future. It is already being used in many different applications, and its versatility makes it suitable for use in many different scenarios. With the development of new technologies, it is likely that the chip model EPF6010AFC100-3 will be used even more widely in the future.
The chip model EPF6010AFC100-3 can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and other intelligent systems. It can also be used in the development and popularization of future intelligent robots. To use the chip model EPF6010AFC100-3 effectively, it is important to have the right technical talents. Those with expertise in artificial intelligence, machine learning, and other related technologies are likely to be in high demand in the future.
In conclusion, the chip model EPF6010AFC100-3 is a highly versatile and advanced integrated circuit that is likely to remain popular in the future. It can be used in many different applications and intelligent scenarios, and has the potential to be used in the development and popularization of future intelligent robots. To use the chip model EPF6010AFC100-3 effectively, it is important to have the right technical talents, such as those with expertise in artificial intelligence and machine learning.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||