Intel Corporation
EPF10K50VBC356-2
EPF10K50VBC356-2 ECAD Model
EPF10K50VBC356-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 2880 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 274 I/O | |
| Output Function | REGISTERED | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA-356 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K50VBC356-2 Datasheet Download
EPF10K50VBC356-2 Overview
The chip model EPF10K50VBC356-2 has become increasingly popular due to its ability to provide high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a common language in the chip industry. This chip model is highly versatile, and is applicable to a wide range of applications.
In terms of industry trends, the chip model EPF10K50VBC356-2 is expected to become even more popular due to its ability to keep up with the ever-evolving technology landscape. It can be used in a variety of advanced communication systems, and is capable of being upgraded to meet the needs of future technologies.
The original design intention of the chip model EPF10K50VBC356-2 was to provide a comprehensive solution for digital signal processing, embedded processing, and image processing. It was designed to be highly efficient and cost-effective, while still being able to handle complex tasks. Its ability to be upgraded and adapted to new technologies makes it an ideal choice for a wide range of applications.
The chip model EPF10K50VBC356-2 is a great choice for those looking for a powerful and reliable chip solution. Its versatile design allows it to be used in a variety of applications, while its ability to be upgraded makes it a great choice for the future. It is a great choice for those looking for a cost-effective and reliable solution that can keep up with the ever-evolving technology landscape.
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5,820 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $60.6658 | $60.6658 |
| 10+ | $60.0134 | $600.1344 |
| 100+ | $56.7518 | $5,675.1840 |
| 1000+ | $53.4902 | $26,745.1200 |
| 10000+ | $48.9240 | $48,924.0000 |
| The price is for reference only, please refer to the actual quotation! | ||