Intel Corporation
EPF10K30EFC484-2
EPF10K30EFC484-2 ECAD Model
EPF10K30EFC484-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 220 | |
| Number of Outputs | 220 | |
| Number of Logic Cells | 1728 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 220 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K30EFC484-2 Datasheet Download
EPF10K30EFC484-2 Overview
The chip model EPF10K30EFC484-2 is a powerful and versatile tool that can be used for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows users to design and program digital systems. This makes the EPF10K30EFC484-2 an ideal choice for applications that require high-performance computing and processing capabilities.
The EPF10K30EFC484-2 can be applied to a variety of intelligent networks and scenarios. It is well-suited for applications that require high-performance computing and processing capabilities. The chip model can be used to develop and deploy future intelligent robots, as it is capable of running complex algorithms and tasks. It can also be used in the era of fully intelligent systems, allowing users to create and deploy intelligent systems that can interact with the environment in a meaningful way.
In order to use the EPF10K30EFC484-2 effectively, users need to have a good understanding of the HDL language. They must also have a strong understanding of the hardware and software components that are used with the chip model. Additionally, users must be familiar with the algorithms and data structures that are used in the development of intelligent systems. This requires a great deal of technical expertise and knowledge.
The EPF10K30EFC484-2 is a powerful and versatile chip model that can be used for a variety of applications. It is well-suited for high-performance computing and processing tasks, as well as for the development and deployment of intelligent systems. It is also capable of running complex algorithms and tasks, making it an ideal choice for the era of fully intelligent systems. In order to use the chip model effectively, users must have a strong understanding of the HDL language, hardware and software components, and algorithms and data structures. With the right technical expertise and knowledge, the EPF10K30EFC484-2 can be used to develop and deploy intelligent robots and systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||