Intel Corporation
EPF10K250EGI599-3
EPF10K250EGI599-3 ECAD Model
EPF10K250EGI599-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 12160 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-CPGA-P599 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 599 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HIPGA | |
| Package Equivalence Code | SPGA599,47X47 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 62.484 mm | |
| Length | 62.484 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HIPGA, SPGA599,47X47 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K250EGI599-3 Datasheet Download
EPF10K250EGI599-3 Overview
The chip model EPF10K250EGI599-3 is a highly advanced integrated circuit designed to meet the needs of the ever-evolving technology industry. It is based on the latest FPGA technology and offers a wide range of features, such as high speed, low power consumption, and the ability to interface with a variety of different systems.
The EPF10K250EGI599-3 chip model has been developed to meet the growing demand for highly efficient and reliable integrated circuit solutions. This chip model is designed to provide the highest performance and reliability, while also providing cost savings. It is also designed to be easily upgradeable, allowing for future upgrades in order to keep up with the latest technology advancements.
The EPF10K250EGI599-3 chip model is designed to provide a powerful, yet cost-effective solution for a variety of different applications. It is capable of supporting high-speed communication systems, as well as providing low-power solutions for embedded systems. In addition, the chip model is designed to be highly flexible and can be easily modified to meet the specific requirements of any given application.
The EPF10K250EGI599-3 chip model is designed to provide the highest performance and reliability, while also providing cost savings. It is also designed to be easily upgradeable, allowing for future upgrades in order to keep up with the latest technology advancements. This chip model is expected to become increasingly popular in the future and is likely to be used in a variety of different applications.
In terms of industry trends, the EPF10K250EGI599-3 chip model is expected to remain popular in the future. This is due to its high performance, low power consumption, and the ability to easily upgrade it for future requirements. In addition, the chip model is expected to be widely used in a variety of different applications, such as high-speed communication systems, embedded systems, and industrial automation.
The original design intention of the EPF10K250EGI599-3 chip model was to provide a powerful, yet cost-effective solution for a variety of different applications. This chip model is designed to be highly flexible and can be easily modified to meet the specific requirements of any given application. As the technology industry continues to evolve, the EPF10K250EGI599-3 chip model is expected to remain popular and be widely used in a variety of different applications.
In terms of future upgrades, the EPF10K250EGI599-3 chip model can be easily upgraded to meet the specific requirements of any given application. This chip model is designed to be highly flexible and can be easily modified to meet the specific requirements of any given application. As the technology industry continues to evolve, the EPF10K250EGI599-3 chip model is expected to remain popular and be widely used in a variety of different applications.
In conclusion, the EPF10K250EGI599-3 chip model is a highly advanced integrated circuit designed to meet the needs of the ever-evolving technology industry. It is based on the latest FPGA technology and offers a wide range of features, such as high speed, low power consumption, and the ability to interface with a variety of different systems. The EPF10K250EGI599-3 chip model is expected to remain popular in the future, due to its high performance, low power consumption, and the ability to easily upgrade it for future requirements. In addition, the chip model is expected to be widely used in a variety of different applications, such as high-speed communication systems, embedded systems, and industrial automation.
You May Also Be Interested In
5,472 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||