EPF10K130EFC484-2
EPF10K130EFC484-2
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rohs

Intel Corporation

EPF10K130EFC484-2


EPF10K130EFC484-2
F18-EPF10K130EFC484-2
Active
LOADABLE PLD, 500 ps, CMOS, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484

EPF10K130EFC484-2 ECAD Model


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EPF10K130EFC484-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 500 ps
Number of Inputs 369
Number of Outputs 369
Number of Logic Cells 6656
Number of I/O Lines 369
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 369 I/O
Output Function MIXED
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF10K130EFC484-2 Datasheet Download


EPF10K130EFC484-2 Overview



The chip model EPF10K130EFC484-2 is a revolutionary product that has been designed to meet the needs of modern communication systems. It is a field-programmable gate array (FPGA), which offers a wide range of features that make it suitable for a variety of applications. It is designed to provide a high-performance, low-power solution for a wide range of communication systems, from basic to advanced.


The original design intention of the EPF10K130EFC484-2 was to create a chip that could be used in a variety of communication systems and that could be easily upgraded in the future. This chip was designed with advanced features, such as high-speed signal processing, low-power consumption, and robust error correction. It also offers a wide range of I/O options, allowing for the integration of various peripherals and other devices.


The EPF10K130EFC484-2 is capable of being used in advanced communication systems, such as 5G and beyond. It is capable of supporting a wide range of network topologies, including mesh, star, and ring networks. It also has the capability to support a variety of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. This chip is also capable of being used in the era of fully intelligent systems, allowing for the development of autonomous systems that can make decisions based on data and information collected from the environment.


The product description of the EPF10K130EFC484-2 includes the following features: a high-performance, low-power FPGA solution; a wide range of I/O options; robust error correction; and support for a variety of network topologies. Specific design requirements for this chip include the ability to support a wide range of signal processing, low-power consumption, and robust error correction. It is also important to consider the cost and availability of the chip, as well as the compatibility with existing systems.


In order to ensure that the EPF10K130EFC484-2 is used in the most effective manner, it is important to consider actual case studies and precautions. For example, it is important to consider the types of networks that the chip will be used in, and the types of applications that it will be used for. It is also important to consider the compatibility of the chip with existing systems, as well as the cost and availability of the chip.


In conclusion, the EPF10K130EFC484-2 is a revolutionary product that has been designed to meet the needs of modern communication systems. It is a field-programmable gate array (FPGA) that offers a wide range of features, making it suitable for a variety of applications. It is capable of being used in advanced communication systems, such as 5G and beyond, and it is capable of supporting a wide range of intelligent scenarios. It is important to consider the product description and specific design requirements, as well as actual case studies and precautions, when using this chip.



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