
Intel Corporation
EPF10K130EFC484-2
EPF10K130EFC484-2 ECAD Model
EPF10K130EFC484-2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 369 | |
Number of Outputs | 369 | |
Number of Logic Cells | 6656 | |
Number of I/O Lines | 369 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 369 I/O | |
Output Function | MIXED | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K130EFC484-2 Datasheet Download
EPF10K130EFC484-2 Overview
The chip model EPF10K130EFC484-2 is a revolutionary product that has been designed to meet the needs of modern communication systems. It is a field-programmable gate array (FPGA), which offers a wide range of features that make it suitable for a variety of applications. It is designed to provide a high-performance, low-power solution for a wide range of communication systems, from basic to advanced.
The original design intention of the EPF10K130EFC484-2 was to create a chip that could be used in a variety of communication systems and that could be easily upgraded in the future. This chip was designed with advanced features, such as high-speed signal processing, low-power consumption, and robust error correction. It also offers a wide range of I/O options, allowing for the integration of various peripherals and other devices.
The EPF10K130EFC484-2 is capable of being used in advanced communication systems, such as 5G and beyond. It is capable of supporting a wide range of network topologies, including mesh, star, and ring networks. It also has the capability to support a variety of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. This chip is also capable of being used in the era of fully intelligent systems, allowing for the development of autonomous systems that can make decisions based on data and information collected from the environment.
The product description of the EPF10K130EFC484-2 includes the following features: a high-performance, low-power FPGA solution; a wide range of I/O options; robust error correction; and support for a variety of network topologies. Specific design requirements for this chip include the ability to support a wide range of signal processing, low-power consumption, and robust error correction. It is also important to consider the cost and availability of the chip, as well as the compatibility with existing systems.
In order to ensure that the EPF10K130EFC484-2 is used in the most effective manner, it is important to consider actual case studies and precautions. For example, it is important to consider the types of networks that the chip will be used in, and the types of applications that it will be used for. It is also important to consider the compatibility of the chip with existing systems, as well as the cost and availability of the chip.
In conclusion, the EPF10K130EFC484-2 is a revolutionary product that has been designed to meet the needs of modern communication systems. It is a field-programmable gate array (FPGA) that offers a wide range of features, making it suitable for a variety of applications. It is capable of being used in advanced communication systems, such as 5G and beyond, and it is capable of supporting a wide range of intelligent scenarios. It is important to consider the product description and specific design requirements, as well as actual case studies and precautions, when using this chip.
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QTY | Unit Price | Ext Price |
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