Intel Corporation
EPF10K10ATC100-1
EPF10K10ATC100-1 ECAD Model
EPF10K10ATC100-1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 66 | |
| Number of Outputs | 66 | |
| Number of Logic Cells | 576 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 66 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 66 I/O | |
| Additional Feature | 576 LOGIC ELEMENTS; 72 LABS | |
| Clock Frequency-Max | 80 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 235 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | TQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K10ATC100-1 Overview
The chip model EPF10K10ATC100-1 is a powerful and versatile tool for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is designed to be used with HDL (Hardware Description Language) and is suitable for a wide range of applications.
The industry trends of the chip model EPF10K10ATC100-1 and the future development of related industries depend on the specific technologies needed. New technologies may be necessary to support the application environment and to ensure the chip model is able to operate effectively.
Regarding the use of the chip model EPF10K10ATC100-1 in the development and popularization of future intelligent robots, it is possible to use the model for this purpose. Technical talents and knowledge in the specific field of the chip model are needed to use the model effectively. They must have the necessary skills and understanding of the chip model and be able to use the HDL language to develop the necessary applications.
The chip model EPF10K10ATC100-1 is a powerful and versatile tool for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related applications. The industry trends of the chip model and the future development of related industries depend on the specific technologies needed. It is possible to use the chip model for the development and popularization of future intelligent robots, but technical talents and knowledge in the specific field of the chip model are needed to use the model effectively.
You May Also Be Interested In
2,136 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||