Intel Corporation
EPF10K100EFC256-1X
EPF10K100EFC256-1X ECAD Model
EPF10K100EFC256-1X Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 4992 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
EPF10K100EFC256-1X Overview
The chip model EPF10K100EFC256-1X is a highly advanced integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language, which allows for more efficient design and implementation of complex algorithms. It has the potential to be used in a variety of applications and can be upgraded in the future.
The EPF10K100EFC256-1X chip is an ideal solution for advanced communication systems. It can be used to support high-speed data transmission, making it well-suited for applications such as 5G networks, internet of things, and autonomous driving. It is also capable of providing intelligent solutions for a variety of scenarios, such as facial recognition, natural language processing, and autonomous navigation.
The EPF10K100EFC256-1X chip is also well-suited for the era of fully intelligent systems. It can be used to support the development of artificial intelligence algorithms, as well as providing the necessary computing power for autonomous systems. It is capable of handling large amounts of data quickly and efficiently, making it an ideal solution for applications such as autonomous robots, smart homes, and smart cities.
In conclusion, the EPF10K100EFC256-1X chip is a powerful and versatile integrated circuit that is suitable for a wide range of applications. It can be used to support advanced communication systems, provide intelligent solutions for a variety of scenarios, and provide the necessary computing power for autonomous systems. It is a great solution for the future of intelligent systems.
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2,000 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||