Intel Corporation
EPF10K100EFC256-1
EPF10K100EFC256-1 ECAD Model
EPF10K100EFC256-1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 4992 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
EPF10K100EFC256-1 Overview
The chip model EPF10K100EFC256-1 is a state-of-the-art electronic device that is widely used in various industries. It has been developed to provide high-performance computing and communication solutions for a wide range of applications. This chip model is a highly integrated, low-power, and low-cost solution that is suitable for a wide range of applications, from consumer electronics to industrial automation.
The EPF10K100EFC256-1 chip model has been designed to meet the needs of the ever-evolving industry. It is capable of providing high-speed data processing and communication solutions for a wide range of applications. This chip model is designed to be highly reliable and is capable of providing a wide range of features and functions. It is also capable of providing support for various communication protocols and can be used in various communication systems.
The EPF10K100EFC256-1 chip model is designed to be highly upgradable and can be used in various scenarios. It is capable of providing support for various technologies, including wireless communication, advanced network protocols, and intelligent systems. This chip model is also capable of providing support for various intelligent scenarios, such as intelligent control systems, autonomous vehicles, and robotics.
The EPF10K100EFC256-1 chip model is designed to be highly reliable and can be used in various communication systems. It is capable of providing high-speed data processing and communication solutions for a wide range of applications. This chip model is also capable of providing support for various intelligent scenarios, such as intelligent control systems, autonomous vehicles, and robotics.
The EPF10K100EFC256-1 chip model is designed to be highly upgradable and can be used in various communication systems. It is capable of providing support for various technologies, including wireless communication, advanced network protocols, and intelligent systems. This chip model is also capable of providing support for various intelligent scenarios, such as intelligent control systems, autonomous vehicles, and robotics.
The EPF10K100EFC256-1 chip model is designed to be highly reliable and can be used in various communication systems. It is capable of providing high-speed data processing and communication solutions for a wide range of applications. Moreover, it is capable of providing support for various technologies, including wireless communication, advanced network protocols, and intelligent systems. This chip model is also capable of providing support for various intelligent scenarios, such as intelligent control systems, autonomous vehicles, and robotics.
In conclusion, the EPF10K100EFC256-1 chip model is an advanced electronic device that is designed to provide high-performance computing and communication solutions for a wide range of applications. It is capable of providing support for various technologies, including wireless communication, advanced network protocols, and intelligent systems. This chip model is also capable of providing support for various intelligent scenarios, such as intelligent control systems, autonomous vehicles, and robotics. It is highly upgradable and is capable of providing high-speed data processing and communication solutions for a wide range of applications. Therefore, it is a highly reliable and cost-effective solution for various industries.
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4,496 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||