Intel Corporation
EP3SL340H1152C4LN
EP3SL340H1152C4LN ECAD Model
EP3SL340H1152C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 337500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, HBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL340H1152C4LN Datasheet Download
EP3SL340H1152C4LN Overview
Chip model EP3SL340H1152C4LN has become an increasingly popular choice for various industries due to its advanced features. It is a highly integrated, low-cost, low-power, and high-performance chip model that can be used in a wide range of applications. It is designed to reduce the complexity and cost of system designs. It is designed to be used in advanced communication systems, networks, and intelligent scenarios.
The chip model EP3SL340H1152C4LN is designed with a wide range of features to meet the demand for high-performance applications. It has a high-speed interface with support for a variety of protocols such as USB 2.0, Ethernet, and Wi-Fi. It also has a powerful processor core, memory, and a variety of peripherals. It is designed to be used in a wide range of applications, such as industrial automation, medical, automotive, and consumer electronics.
In terms of industry trends, the chip model EP3SL340H1152C4LN is expected to continue to be a popular choice for various industries due to its advanced features. It is expected to be used more and more in advanced communication systems, networks, and intelligent scenarios. As technology advances and more advanced communication systems are developed, the chip model EP3SL340H1152C4LN is expected to be used more and more in these applications.
The original design intention of the chip model EP3SL340H1152C4LN was to provide a low-cost, low-power, and high-performance solution for various industries. It is designed to be used in a wide range of applications, from industrial automation to medical, automotive, and consumer electronics. It is designed to reduce the complexity and cost of system designs. It is also designed to be used in advanced communication systems, networks, and intelligent scenarios.
The possibility of future upgrades for the chip model EP3SL340H1152C4LN is high due to its advanced features. It is designed to be used in a wide range of applications and is expected to be used more and more in advanced communication systems, networks, and intelligent scenarios. It is expected that the chip model EP3SL340H1152C4LN will be upgraded in the future to meet the demand for more advanced applications.
The possible future applications of the chip model EP3SL340H1152C4LN in networks and intelligent scenarios are numerous. It is expected to be used more and more in advanced communication systems, networks, and intelligent scenarios. It is also expected to be used in the era of fully intelligent systems. It is designed to reduce the complexity and cost of system designs and is expected to be used more and more in these applications.
Overall, the chip model EP3SL340H1152C4LN is an advanced and highly integrated solution for various industries. It is designed to reduce the complexity and cost of system designs and is expected to be used more and more in advanced communication systems, networks, and intelligent scenarios. It is also expected to be used in the era of fully intelligent systems. Therefore, it is important to consider the industry trends of the chip model EP3SL340H1152C4LN and whether the application environment requires the support of new technologies.
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4,549 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,984.0537 | $11,984.0537 |
| 10+ | $11,855.1929 | $118,551.9286 |
| 100+ | $11,210.8889 | $1,121,088.8904 |
| 1000+ | $10,566.5849 | $5,283,292.4720 |
| 10000+ | $9,664.5594 | $9,664,559.4000 |
| The price is for reference only, please refer to the actual quotation! | ||