Intel Corporation
EP3SL200H780C2N
EP3SL200H780C2N ECAD Model
EP3SL200H780C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, HBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200H780C2N Datasheet Download
EP3SL200H780C2N Overview
The chip model EP3SL200H780C2N is a high-performance digital signal processor (DSP) designed for a wide range of applications. The chip is capable of handling a variety of tasks, such as embedded processing, image processing, and high-performance digital signal processing. It requires the use of HDL language in order to program the chip, making it suitable for experienced users and those with a background in HDL programming.
The product description and design requirements of the EP3SL200H780C2N chip model are well documented, making it easier for developers to understand and use the chip. The chip model is designed to be highly efficient, with low power consumption and a wide range of features. It also has a high speed and high performance, making it suitable for a variety of applications.
Case studies have been conducted and documented to demonstrate the capabilities of the EP3SL200H780C2N chip model. These studies provide valuable insight into the chip model's performance and capabilities, as well as potential applications and pitfalls. Additionally, there are precautions and tips for developers to consider when using the chip model.
The EP3SL200H780C2N chip model can be used in the development and popularization of future intelligent robots. The chip model's high-performance digital signal processing and embedded processing capabilities make it suitable for use in robotic systems. Additionally, its low power consumption and wide range of features make it suitable for use in a variety of robotic applications.
In order to use the EP3SL200H780C2N chip model effectively, developers need to have a strong understanding of HDL programming and the chip model's design requirements. Additionally, developers should be familiar with the case studies and precautions associated with the chip model in order to ensure that their application is successful. With the right knowledge and experience, developers can use the EP3SL200H780C2N chip model to create powerful and efficient robotic systems.
You May Also Be Interested In
2,077 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,651.6133 | $5,651.6133 |
| 10+ | $5,590.8432 | $55,908.4322 |
| 100+ | $5,286.9930 | $528,699.3045 |
| 1000+ | $4,983.1429 | $2,491,571.4350 |
| 10000+ | $4,557.7526 | $4,557,752.6250 |
| The price is for reference only, please refer to the actual quotation! | ||