
Intel Corporation
EP3C25U256C8
EP3C25U256C8 ECAD Model
EP3C25U256C8 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 156 | |
Number of Outputs | 156 | |
Number of Logic Cells | 24624 | |
Number of CLBs | 24624 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24624 CLBS | |
Clock Frequency-Max | 472.5 MHz | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA256,16X16,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 14 X 14 MM, 0.80 MM PITCH, UBGA-256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3C25U256C8 Datasheet Download
EP3C25U256C8 Overview
The chip model EP3C25U256C8 is an advanced FPGA (Field Programmable Gate Array) device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is a highly versatile and cost-effective solution for a wide range of applications.
The EP3C25U256C8 is based on Altera's Cyclone III FPGA architecture, which is designed for high-performance digital signal processing and embedded processing applications. It features a high-performance multi-layer bus architecture, along with a wide range of embedded memory and logic blocks. This FPGA device also offers integrated support for HDL (Hardware Description Language) programming, making it easy to program and debug.
The EP3C25U256C8 is designed to support a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and other applications. It is also designed to be easily upgradable, allowing users to add new features and capabilities as their needs evolve. This makes the EP3C25U256C8 a highly versatile and cost-effective solution for a wide range of applications.
The product description of the EP3C25U256C8 includes a wide range of features, such as a high-performance multi-layer bus architecture, a wide range of embedded memory and logic blocks, and integrated support for HDL programming. It also includes a wide range of peripherals, such as Ethernet, USB, UART, and more.
When using the EP3C25U256C8 for advanced communication systems, it is important to consider the specific design requirements of the project. This includes the type of communication protocol being used, the data rate, and the power requirements. It is also important to consider any potential performance bottlenecks, such as memory bandwidth or clock speed. Furthermore, it is important to consider any potential EMI (electromagnetic interference) issues, as well as any potential safety or security concerns.
Case studies of successful projects using the EP3C25U256C8 can provide useful insight into the design process and potential pitfalls. Additionally, it is important to consider any potential precautions, such as ensuring that all components are properly grounded and shielded, and that the design meets all applicable safety and security standards.
In conclusion, the chip model EP3C25U256C8 is an advanced FPGA device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be easily upgradable, allowing users to add new features and capabilities as their needs evolve. When using the EP3C25U256C8 for advanced communication systems, it is important to consider the specific design requirements of the project, as well as any potential performance bottlenecks, EMI issues, and safety and security concerns. Case studies of successful projects can provide useful insight into the design process and potential pitfalls, as well as any potential precautions that should be taken.
You May Also Be Interested In
3,992 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $91.1856 | $91.1856 |
10+ | $90.2051 | $902.0508 |
100+ | $85.3026 | $8,530.2630 |
1000+ | $80.4002 | $40,200.0900 |
10000+ | $73.5368 | $73,536.7500 |
The price is for reference only, please refer to the actual quotation! |