EP3C25U256C8
EP3C25U256C8
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rohs

Intel Corporation

EP3C25U256C8


EP3C25U256C8
F18-EP3C25U256C8
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 14 X 14 MM, 0.80 MM PITCH, UBGA-256
14 X 14 MM, 0.80 MM PITCH, UBGA-256

EP3C25U256C8 ECAD Model


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EP3C25U256C8 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 156
Number of Outputs 156
Number of Logic Cells 24624
Number of CLBs 24624
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 24624 CLBS
Clock Frequency-Max 472.5 MHz
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA256,16X16,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Width 14 mm
Length 14 mm
Seated Height-Max 1.5 mm
Ihs Manufacturer INTEL CORP
Package Description 14 X 14 MM, 0.80 MM PITCH, UBGA-256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3C25U256C8 Datasheet Download


EP3C25U256C8 Overview



The chip model EP3C25U256C8 is an advanced FPGA (Field Programmable Gate Array) device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is a highly versatile and cost-effective solution for a wide range of applications.


The EP3C25U256C8 is based on Altera's Cyclone III FPGA architecture, which is designed for high-performance digital signal processing and embedded processing applications. It features a high-performance multi-layer bus architecture, along with a wide range of embedded memory and logic blocks. This FPGA device also offers integrated support for HDL (Hardware Description Language) programming, making it easy to program and debug.


The EP3C25U256C8 is designed to support a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and other applications. It is also designed to be easily upgradable, allowing users to add new features and capabilities as their needs evolve. This makes the EP3C25U256C8 a highly versatile and cost-effective solution for a wide range of applications.


The product description of the EP3C25U256C8 includes a wide range of features, such as a high-performance multi-layer bus architecture, a wide range of embedded memory and logic blocks, and integrated support for HDL programming. It also includes a wide range of peripherals, such as Ethernet, USB, UART, and more.


When using the EP3C25U256C8 for advanced communication systems, it is important to consider the specific design requirements of the project. This includes the type of communication protocol being used, the data rate, and the power requirements. It is also important to consider any potential performance bottlenecks, such as memory bandwidth or clock speed. Furthermore, it is important to consider any potential EMI (electromagnetic interference) issues, as well as any potential safety or security concerns.


Case studies of successful projects using the EP3C25U256C8 can provide useful insight into the design process and potential pitfalls. Additionally, it is important to consider any potential precautions, such as ensuring that all components are properly grounded and shielded, and that the design meets all applicable safety and security standards.


In conclusion, the chip model EP3C25U256C8 is an advanced FPGA device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be easily upgradable, allowing users to add new features and capabilities as their needs evolve. When using the EP3C25U256C8 for advanced communication systems, it is important to consider the specific design requirements of the project, as well as any potential performance bottlenecks, EMI issues, and safety and security concerns. Case studies of successful projects can provide useful insight into the design process and potential pitfalls, as well as any potential precautions that should be taken.



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Unit Price: $98.049
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Pricing (USD)

QTY Unit Price Ext Price
1+ $91.1856 $91.1856
10+ $90.2051 $902.0508
100+ $85.3026 $8,530.2630
1000+ $80.4002 $40,200.0900
10000+ $73.5368 $73,536.7500
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