
Intel Corporation
EP3C25F324C6N
EP3C25F324C6N ECAD Model
EP3C25F324C6N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 215 | |
Number of Outputs | 215 | |
Number of Logic Cells | 24624 | |
Number of CLBs | 24624 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 24624 CLBS | |
Clock Frequency-Max | 472.5 MHz | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | R-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2.2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3C25F324C6N Datasheet Download
EP3C25F324C6N Overview
The chip model EP3C25F324C6N is a high-performance, low-power, and cost-effective field-programmable gate array (FPGA) designed to meet the needs of a wide range of applications. It is suitable for applications such as high-performance digital signal processing, embedded processing, image processing, and other advanced communication systems.
The original design intention of the EP3C25F324C6N was to provide a low-cost solution for applications that require high-performance, low-power, and cost-effective FPGA solutions. It is designed with a relatively small footprint and low power consumption, making it ideal for applications that require a small form factor. The EP3C25F324C6N also has the potential to be upgraded with future technology advancements, allowing for increased performance and functionality.
The EP3C25F324C6N is designed for use with the HDL language. This allows for the implementation of complex logic functions and the ability to create custom designs quickly and efficiently. The chip model also provides a wide range of features, including high-speed transceivers, high-performance DSP blocks, and embedded memory blocks, making it suitable for a variety of applications.
When designing with the EP3C25F324C6N, it is important to consider the specific design requirements of the application. This includes the size of the design, the number of components, the speed of operation, and the power requirements. Additionally, it is important to consider the overall system architecture, as well as the potential for future upgrades.
To ensure successful implementation of the EP3C25F324C6N, it is important to review actual case studies and consider the potential pitfalls associated with the chip model. Additionally, it is important to consider the potential for future upgrades, as well as the potential for compatibility with existing systems.
Overall, the EP3C25F324C6N is a high-performance, low-power, and cost-effective FPGA solution that is suitable for a wide range of applications. It is designed with a small form factor and low power consumption, and it is designed for use with the HDL language. When designing with the EP3C25F324C6N, it is important to consider the specific design requirements of the application, as well as the potential for future upgrades and compatibility with existing systems.
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4,545 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $146.3189 | $146.3189 |
10+ | $144.7455 | $1,447.4553 |
100+ | $136.8789 | $13,687.8927 |
1000+ | $129.0123 | $64,506.1610 |
10000+ | $117.9991 | $117,999.0750 |
The price is for reference only, please refer to the actual quotation! |