EP3C25F256C6
EP3C25F256C6
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3C25F256C6


EP3C25F256C6
F18-EP3C25F256C6
Active
IC FPGA 156 I/O 256FBGA
256-FBGA (17x17)

EP3C25F256C6 ECAD Model


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EP3C25F256C6 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.2 V
Number of Inputs 156
Number of Outputs 156
Number of Logic Cells 24624
Number of CLBs 24624
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 24624 CLBS
Clock Frequency-Max 472.5 MHz
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

EP3C25F256C6 Overview



The chip model EP3C25F256C6 is a highly advanced integrated circuit (IC), developed by Altera Corporation, a leading semiconductor manufacturer. This IC is widely used in various networks and applications, including communication, multimedia, and consumer electronics. It is a powerful, high-performance, and cost-effective IC that offers a wide range of features and capabilities.


The EP3C25F256C6 is designed to provide a variety of features and capabilities, including high-speed data transfer, low power consumption, and scalability. It is also designed to support a variety of applications, including communication, multimedia, and consumer electronics. The EP3C25F256C6 is also designed to support a variety of intelligent applications, including artificial intelligence, machine learning, and robotics.


The EP3C25F256C6 is also designed to provide a high level of flexibility and scalability, allowing it to be used in a variety of different applications. This IC is also designed to be used in a variety of different environments, such as industrial, automotive, and consumer environments. The EP3C25F256C6 is also designed to be compatible with a variety of different operating systems, including Windows, Linux, and MacOS.


In terms of industry trends, the EP3C25F256C6 is expected to continue to be widely used in various networks and applications, as well as in intelligent scenarios. With the development of technology, the EP3C25F256C6 is expected to become even more widely used in the future. It is expected that the EP3C25F256C6 will be used in the era of fully intelligent systems, such as autonomous driving and smart homes.


In terms of product description, the EP3C25F256C6 is designed to provide a wide range of features and capabilities. It is designed to support a variety of applications, including communication, multimedia, and consumer electronics. It is also designed to support a variety of intelligent applications, such as artificial intelligence, machine learning, and robotics. The EP3C25F256C6 is also designed to provide a high level of flexibility and scalability, allowing it to be used in a variety of different applications.


When considering the design requirements of the EP3C25F256C6, it is important to consider the specific needs of the application and environment. For example, the EP3C25F256C6 may require additional features and capabilities, such as high-speed data transfer, low power consumption, and scalability. Additionally, it is important to consider the specific requirements of the application and environment, such as the operating system, the type of application, and the environment in which the EP3C25F256C6 will be used.


In terms of case studies, there are a variety of case studies available that provide an in-depth look at the EP3C25F256C6 and its various applications. Additionally, there are a variety of precautions that should be taken when using the EP3C25F256C6, such as ensuring that the device is properly connected and that the environment is suitable for the device.


Overall, the EP3C25F256C6 is a highly advanced integrated circuit that is designed to provide a variety of features and capabilities. It is expected to be widely used in various networks and applications, as well as in intelligent scenarios. When considering the design requirements of the EP3C25F256C6, it is important to consider the specific needs of the application and environment, as well as the potential case studies and precautions.



1,333 In Stock


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Unit Price: $143.3266
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $133.2937 $133.2937
10+ $131.8605 $1,318.6047
100+ $124.6941 $12,469.4142
1000+ $117.5278 $58,763.9060
10000+ $107.4950 $107,494.9500
The price is for reference only, please refer to the actual quotation!

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