
Intel Corporation
EP3C25F256C6
EP3C25F256C6 ECAD Model
EP3C25F256C6 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 156 | |
Number of Outputs | 156 | |
Number of Logic Cells | 24624 | |
Number of CLBs | 24624 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24624 CLBS | |
Clock Frequency-Max | 472.5 MHz | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1 MM PITCH, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel |
EP3C25F256C6 Overview
The chip model EP3C25F256C6 is a highly advanced integrated circuit (IC), developed by Altera Corporation, a leading semiconductor manufacturer. This IC is widely used in various networks and applications, including communication, multimedia, and consumer electronics. It is a powerful, high-performance, and cost-effective IC that offers a wide range of features and capabilities.
The EP3C25F256C6 is designed to provide a variety of features and capabilities, including high-speed data transfer, low power consumption, and scalability. It is also designed to support a variety of applications, including communication, multimedia, and consumer electronics. The EP3C25F256C6 is also designed to support a variety of intelligent applications, including artificial intelligence, machine learning, and robotics.
The EP3C25F256C6 is also designed to provide a high level of flexibility and scalability, allowing it to be used in a variety of different applications. This IC is also designed to be used in a variety of different environments, such as industrial, automotive, and consumer environments. The EP3C25F256C6 is also designed to be compatible with a variety of different operating systems, including Windows, Linux, and MacOS.
In terms of industry trends, the EP3C25F256C6 is expected to continue to be widely used in various networks and applications, as well as in intelligent scenarios. With the development of technology, the EP3C25F256C6 is expected to become even more widely used in the future. It is expected that the EP3C25F256C6 will be used in the era of fully intelligent systems, such as autonomous driving and smart homes.
In terms of product description, the EP3C25F256C6 is designed to provide a wide range of features and capabilities. It is designed to support a variety of applications, including communication, multimedia, and consumer electronics. It is also designed to support a variety of intelligent applications, such as artificial intelligence, machine learning, and robotics. The EP3C25F256C6 is also designed to provide a high level of flexibility and scalability, allowing it to be used in a variety of different applications.
When considering the design requirements of the EP3C25F256C6, it is important to consider the specific needs of the application and environment. For example, the EP3C25F256C6 may require additional features and capabilities, such as high-speed data transfer, low power consumption, and scalability. Additionally, it is important to consider the specific requirements of the application and environment, such as the operating system, the type of application, and the environment in which the EP3C25F256C6 will be used.
In terms of case studies, there are a variety of case studies available that provide an in-depth look at the EP3C25F256C6 and its various applications. Additionally, there are a variety of precautions that should be taken when using the EP3C25F256C6, such as ensuring that the device is properly connected and that the environment is suitable for the device.
Overall, the EP3C25F256C6 is a highly advanced integrated circuit that is designed to provide a variety of features and capabilities. It is expected to be widely used in various networks and applications, as well as in intelligent scenarios. When considering the design requirements of the EP3C25F256C6, it is important to consider the specific needs of the application and environment, as well as the potential case studies and precautions.
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1,333 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $133.2937 | $133.2937 |
10+ | $131.8605 | $1,318.6047 |
100+ | $124.6941 | $12,469.4142 |
1000+ | $117.5278 | $58,763.9060 |
10000+ | $107.4950 | $107,494.9500 |
The price is for reference only, please refer to the actual quotation! |