Intel Corporation
EP3C25E144C7N
EP3C25E144C7N ECAD Model
EP3C25E144C7N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 24624 | |
| Number of CLBs | 24624 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 24624 CLBS | |
| Clock Frequency-Max | 472.5 MHz | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | R-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 22 X 22 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LEAD FREE, EQFP-144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C25E144C7N Datasheet Download
EP3C25E144C7N Overview
The chip model EP3C25E144C7N is a high-performance field-programmable gate array (FPGA) product developed by Altera Corporation. This chip is designed to provide a cost-effective solution for system designers and engineers. It is based on the company’s Stratix III technology, which provides a high-performance, low-power platform for system designs.
The EP3C25E144C7N is designed to provide a wide range of features, including a large number of dedicated logic blocks, a large number of dedicated I/O pins, multiple clock networks, and a wide range of configuration options. This chip is suitable for a wide range of applications, including high-speed data processing, embedded systems, communications, and industrial automation.
The EP3C25E144C7N is designed to be highly flexible, allowing users to customize their system designs based on their specific needs. It is designed to be highly scalable, allowing users to upgrade their system designs as new technologies become available. It is also designed to be highly reliable, with a long life cycle and a high level of performance.
In terms of industry trends, the EP3C25E144C7N is designed to be compatible with a wide range of existing and emerging technologies. For example, it is designed to be compatible with the latest Ethernet, USB, and Serial ATA standards. It is also designed to be compatible with the latest wireless communication technologies, such as Wi-Fi and Bluetooth.
In terms of future development, the EP3C25E144C7N is designed to be upgradable to support new technologies as they become available. It is also designed to be able to support advanced communication systems, such as 5G networks and the Internet of Things (IoT). The chip is designed to be highly reliable, with a long life cycle and a high level of performance.
The EP3C25E144C7N is designed to be highly customizable, allowing users to tailor their system designs to their specific needs. It is designed to be highly reliable, with a long life cycle and a high level of performance. It is also designed to be highly scalable, allowing users to upgrade their system designs as new technologies become available.
In terms of product description, the EP3C25E144C7N is a high-performance FPGA product that provides a cost-effective solution for system designers and engineers. It is based on the company’s Stratix III technology, which provides a high-performance, low-power platform for system designs. It is designed to provide a wide range of features, including a large number of dedicated logic blocks, a large number of dedicated I/O pins, multiple clock networks, and a wide range of configuration options.
In terms of actual case studies, the EP3C25E144C7N has been successfully used in a variety of applications, including high-speed data processing, embedded systems, communications, and industrial automation. It has also been used in the development of advanced communication systems, such as 5G networks and the Internet of Things (IoT).
Finally, in terms of precautions, the EP3C25E144C7N should be used in accordance with the manufacturer’s instructions. It should be installed and operated in accordance with the manufacturer’s instructions and in accordance with the applicable safety regulations. It should also be inspected regularly for any signs of damage or wear.
In conclusion, the EP3C25E144C7N is a high-performance FPGA product that provides a cost-effective solution for system designers and engineers. It is designed to be highly flexible, allowing users to customize their system designs based on their specific needs. It is also designed to be highly scalable, allowing users to upgrade their system designs as new technologies become available. It is also designed to be highly reliable, with a long life cycle and a high level of performance. It has been successfully used in a variety of applications, including high-speed data processing, embedded systems, communications, and industrial automation. Finally, it should be used in accordance with the manufacturer’s instructions and in accordance with the applicable safety regulations.
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5,072 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $245.8382 | $245.8382 |
| 10+ | $243.1948 | $2,431.9482 |
| 100+ | $229.9777 | $22,997.7714 |
| 1000+ | $216.7606 | $108,380.3020 |
| 10000+ | $198.2567 | $198,256.6500 |
| The price is for reference only, please refer to the actual quotation! | ||