
Intel Corporation
EP2SGX90EF1152C3
EP2SGX90EF1152C3 ECAD Model
EP2SGX90EF1152C3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 558 | |
Number of Outputs | 558 | |
Number of Logic Cells | 90960 | |
Number of CLBs | 90960 | |
Combinatorial Delay of a CLB-Max | 4.45 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 90960 CLBS | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2,1.2/3.3,3.3 V | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | MS-034AAR-1, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP2SGX90EF1152C3 Datasheet Download
EP2SGX90EF1152C3 Overview
The chip model EP2SGX90EF1152C3 is an advanced model of FPGA (Field Programmable Gate Array) chip, which is manufactured by Altera Corporation, a leader in semiconductor and system solutions. This model is designed to provide high performance, low power consumption, and cost-effective solutions for a wide variety of applications. It has a wide range of features, such as high-speed transceivers, high-density memory, and high-performance logic, which make it suitable for a variety of applications.
The chip model EP2SGX90EF1152C3 has many advantages, such as its high performance, low power consumption, and cost-effectiveness. It is also highly flexible and can be used for a variety of applications, including high-speed communication, high-density memory, and high-performance logic. Moreover, it can be used for a variety of applications in networks, such as routers, switches, and gateways.
The expected demand for the chip model EP2SGX90EF1152C3 is expected to increase in the future, due to its advantages and potential applications. It is expected to be used in a variety of applications, including high-speed communication, high-density memory, and high-performance logic. Moreover, it is expected to be used in the era of fully intelligent systems, as it is capable of providing high-performance, low power consumption, and cost-effective solutions.
The chip model EP2SGX90EF1152C3 can be used in the development and popularization of future intelligent robots. It can be used to provide high-performance, low power consumption, and cost-effective solutions for a variety of applications, such as high-speed communication, high-density memory, and high-performance logic. Moreover, it can be used for a variety of intelligent scenarios, such as image recognition, natural language processing, and artificial intelligence.
In order to effectively use the chip model EP2SGX90EF1152C3, technical talents with knowledge of digital signal processing, computer architecture, and programming are needed. Furthermore, knowledge of FPGA design, embedded systems, and networking is also required. With the right technical knowledge and skills, the chip model EP2SGX90EF1152C3 can be used to develop and popularize future intelligent robots.
You May Also Be Interested In
4,090 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,538.7690 | $3,538.7690 |
10+ | $3,500.7178 | $35,007.1776 |
100+ | $3,310.4614 | $331,046.1360 |
1000+ | $3,120.2050 | $1,560,102.4800 |
10000+ | $2,853.8460 | $2,853,846.0000 |
The price is for reference only, please refer to the actual quotation! |