EP2SGX90EF1152C3
EP2SGX90EF1152C3
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rohs

Intel Corporation

EP2SGX90EF1152C3


EP2SGX90EF1152C3
F18-EP2SGX90EF1152C3
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, MS-034AAR-1, FBGA-1152
MS-034AAR-1, FBGA-1152

EP2SGX90EF1152C3 ECAD Model


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EP2SGX90EF1152C3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 558
Number of Outputs 558
Number of Logic Cells 90960
Number of CLBs 90960
Combinatorial Delay of a CLB-Max 4.45 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 90960 CLBS
Clock Frequency-Max 717 MHz
Power Supplies 1.2,1.2/3.3,3.3 V
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description MS-034AAR-1, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP2SGX90EF1152C3 Datasheet Download


EP2SGX90EF1152C3 Overview



The chip model EP2SGX90EF1152C3 is an advanced model of FPGA (Field Programmable Gate Array) chip, which is manufactured by Altera Corporation, a leader in semiconductor and system solutions. This model is designed to provide high performance, low power consumption, and cost-effective solutions for a wide variety of applications. It has a wide range of features, such as high-speed transceivers, high-density memory, and high-performance logic, which make it suitable for a variety of applications.


The chip model EP2SGX90EF1152C3 has many advantages, such as its high performance, low power consumption, and cost-effectiveness. It is also highly flexible and can be used for a variety of applications, including high-speed communication, high-density memory, and high-performance logic. Moreover, it can be used for a variety of applications in networks, such as routers, switches, and gateways.


The expected demand for the chip model EP2SGX90EF1152C3 is expected to increase in the future, due to its advantages and potential applications. It is expected to be used in a variety of applications, including high-speed communication, high-density memory, and high-performance logic. Moreover, it is expected to be used in the era of fully intelligent systems, as it is capable of providing high-performance, low power consumption, and cost-effective solutions.


The chip model EP2SGX90EF1152C3 can be used in the development and popularization of future intelligent robots. It can be used to provide high-performance, low power consumption, and cost-effective solutions for a variety of applications, such as high-speed communication, high-density memory, and high-performance logic. Moreover, it can be used for a variety of intelligent scenarios, such as image recognition, natural language processing, and artificial intelligence.


In order to effectively use the chip model EP2SGX90EF1152C3, technical talents with knowledge of digital signal processing, computer architecture, and programming are needed. Furthermore, knowledge of FPGA design, embedded systems, and networking is also required. With the right technical knowledge and skills, the chip model EP2SGX90EF1152C3 can be used to develop and popularize future intelligent robots.



4,090 In Stock


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Unit Price: $3,805.128
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,538.7690 $3,538.7690
10+ $3,500.7178 $35,007.1776
100+ $3,310.4614 $331,046.1360
1000+ $3,120.2050 $1,560,102.4800
10000+ $2,853.8460 $2,853,846.0000
The price is for reference only, please refer to the actual quotation!

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