Intel Corporation
EP2AGX125DF25C6G
EP2AGX125DF25C6G ECAD Model
EP2AGX125DF25C6G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 118143 | |
| Number of CLBs | 4964 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4964 CLBS | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B572 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 572 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA572,24X24,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| Length | 25 mm | |
| Seated Height-Max | 2.15 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-572 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2AGX125DF25C6G Datasheet Download
EP2AGX125DF25C6G Overview
The chip model EP2AGX125DF25C6G is a cutting-edge technology that has the potential to revolutionize the way networks and intelligent systems are developed and used. It is a highly capable chip that is suitable for high-performance digital signal processing, embedded processing, and image processing applications. The chip requires the use of HDL language for programming, which makes it a valuable tool for developers.
The EP2AGX125DF25C6G chip has the potential to be a game-changer in the development of intelligent systems. It can be used to create powerful networks and intelligent scenarios, such as autonomous driving, smart home systems, and more. With its high-performance capabilities and efficient programming language, the chip can be used to create complex and efficient systems.
The EP2AGX125DF25C6G chip can also be applied to the development and popularization of future intelligent robots. Its powerful capabilities and programming language make it an ideal candidate for the development of robots. With its powerful capabilities, the chip can be used to create robots with advanced features and capabilities.
To effectively use the EP2AGX125DF25C6G chip, developers need to have a good understanding of the HDL language. They should also have a good understanding of the chip's capabilities and how to use them to create powerful and efficient systems. With the right technical talents, the EP2AGX125DF25C6G chip can be used to create powerful and efficient systems that can revolutionize the way networks and intelligent systems are developed and used.
You May Also Be Interested In
5,005 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,811.0369 | $3,811.0369 |
| 10+ | $3,770.0580 | $37,700.5797 |
| 100+ | $3,565.1635 | $356,516.3517 |
| 1000+ | $3,360.2691 | $1,680,134.5310 |
| 10000+ | $3,073.4168 | $3,073,416.8250 |
| The price is for reference only, please refer to the actual quotation! | ||