Intel Corporation
EP2A25B724C9
EP2A25B724C9 ECAD Model
EP2A25B724C9 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Propagation Delay | 2.23 ns | |
| Number of Inputs | 524 | |
| Number of Outputs | 524 | |
| Number of Logic Cells | 24320 | |
| Number of I/O Lines | 536 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 536 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B724 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 724 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA724,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA724,27X27,50 | |
| Pin Count | 724 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP2A25B724C9 Overview
The chip model EP2A25B724C9 is a highly advanced semiconductor product designed for a wide range of applications. It is designed to provide powerful performance with minimal power consumption, making it ideal for use in a variety of scenarios. This chip model is capable of providing excellent performance in both wired and wireless networks, making it a great choice for a variety of applications.
In terms of industry trends, the chip model EP2A25B724C9 is likely to be used in many areas, including intelligent systems, IoT, and cloud computing. As the demand for intelligent systems increases, the chip model EP2A25B724C9 will become increasingly important as a reliable and efficient solution for these applications. With the development of new technologies, such as 5G and AI, the chip model EP2A25B724C9 will be able to provide the necessary support for the application environment.
The product description of the chip model EP2A25B724C9 states that it is a highly integrated, low-power semiconductor product designed for a variety of applications. It is designed to provide excellent performance with minimal power consumption, making it an ideal choice for a variety of scenarios. This chip model is capable of providing excellent performance in both wired and wireless networks, making it a great choice for a variety of applications.
In addition, the chip model EP2A25B724C9 is designed with a variety of features and functions that make it suitable for a wide range of applications. It is designed to support a variety of protocols and standards, including Ethernet, Wi-Fi, and Bluetooth. It also supports advanced security features, making it a suitable choice for applications that require secure data transmission.
When using the chip model EP2A25B724C9, it is important to consider the specific design requirements of the application and the environment in which it will be used. This includes the power requirements, the operating temperature range, and the frequency range. It is also important to consider the potential environmental hazards that could affect the performance of the chip model, such as dust, moisture, and electromagnetic interference.
In conclusion, the chip model EP2A25B724C9 is a highly advanced semiconductor product designed for a wide range of applications. It is designed to provide powerful performance with minimal power consumption, making it ideal for use in a variety of scenarios. Its potential future applications in networks and intelligent scenarios, along with its design requirements and actual case studies, make it an excellent choice for a variety of applications.
You May Also Be Interested In
2,481 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||