Intel Corporation
EP20K60EFC324-1N
EP20K60EFC324-1N ECAD Model
EP20K60EFC324-1N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.72 ns | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 196 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 196 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP20K60EFC324-1N Overview
The chip model EP20K60EFC324-1N is a remarkable piece of technology that has the potential to revolutionize the way we communicate and interact with our environment. Developed by Altera, this model is one of the most advanced FPGA chips available on the market today. It is designed to meet the needs of modern communication systems, offering high-speed, low-power performance, and a wide range of features.
The EP20K60EFC324-1N is a highly integrated chip that can be used in a variety of applications, from high-speed network switches to low-power mobile devices. It offers a wide range of features, including a high-speed transceiver, a powerful processor, and a large memory. This chip is designed to be used in a variety of communication systems, including wireless networks, cellular networks, and even satellite communications.
The EP20K60EFC324-1N is designed to be highly efficient, offering power savings of up to 90% compared to traditional FPGAs. It is also designed to be highly scalable, allowing for future upgrades and modifications. This chip is also designed to be compatible with a wide range of communication protocols, allowing for the development of advanced communication systems.
The EP20K60EFC324-1N is also designed to be used in a variety of intelligent scenarios, such as intelligent lighting systems, home automation systems, and even autonomous vehicles. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT). This chip is also capable of being used in networks, allowing for the development of more efficient and secure networks.
The EP20K60EFC324-1N is a remarkable piece of technology that has the potential to revolutionize the way we communicate and interact with our environment. With its high-speed, low-power performance, and wide range of features, this chip is sure to be in high demand in the years to come. Its ability to be used in a variety of intelligent scenarios, as well as its compatibility with a wide range of communication protocols, makes it an ideal choice for the development of advanced communication systems. With its scalability and power-saving capabilities, the EP20K60EFC324-1N is sure to be a major player in the future of communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||