
Intel Corporation
EP20K60EFC144-1X
EP20K60EFC144-1X ECAD Model
EP20K60EFC144-1X Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 1.72 ns | |
Number of Inputs | 85 | |
Number of Outputs | 85 | |
Number of Logic Cells | 2560 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 93 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 93 I/O | |
Clock Frequency-Max | 160 MHz | |
Output Function | MACROCELL | |
Power Supplies | 1.8,1.8/3.3 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 235 | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm | |
Length | 13 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | FINE LINE, BGA-144 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 144 |
EP20K60EFC144-1X Overview
The chip model EP20K60EFC144-1X is a high-performance digital signal processing, embedded processing and image processing chip, which requires the use of HDL language. It is designed to meet the needs of complex computing tasks and can be used in a variety of applications, such as image processing, video processing, and communications systems.
The EP20K60EFC144-1X chip is designed to provide high-performance computing capabilities while maintaining low power consumption. It has a wide range of features and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing. The chip also supports a variety of HDL languages, making it suitable for a variety of application scenarios.
The EP20K60EFC144-1X chip is designed to meet the needs of today's rapidly changing technology landscape. It is designed to be easily upgradable and can be used in a variety of applications, including advanced communication systems. The chip is designed to be flexible and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing.
The EP20K60EFC144-1X chip is designed to provide high-performance computing capabilities while maintaining low power consumption. It has a wide range of features and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing. The chip also supports a variety of HDL languages, making it suitable for a variety of application scenarios.
The EP20K60EFC144-1X chip is designed to meet the needs of today's rapidly changing technology landscape. It is designed to be easily upgradable and can be used in a variety of applications, including advanced communication systems. In addition, the chip is designed to be flexible and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing.
The EP20K60EFC144-1X chip is designed to provide high-performance computing capabilities while maintaining low power consumption. It has a wide range of features and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing. The chip also supports a variety of HDL languages, making it suitable for a variety of application scenarios.
The EP20K60EFC144-1X chip is designed to meet the needs of today's rapidly changing technology landscape. It is designed to be easily upgradable and can be used in a variety of applications, including advanced communication systems. It can also be used in a variety of other applications, such as image processing, video processing, and communications systems.
The EP20K60EFC144-1X chip is designed with the intention of providing the highest performance while maintaining low power consumption. It has a wide range of features and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing. The chip also supports a variety of HDL languages, making it suitable for a variety of application scenarios.
The EP20K60EFC144-1X chip is designed with the intention of being able to easily upgrade and can be used in a variety of applications, including advanced communication systems. It is also designed to be flexible and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing.
In terms of industry trends and future development of related industries, the EP20K60EFC144-1X chip is designed to meet the needs of the ever-changing technology landscape. It is designed to be easily upgradable and can be used in a variety of applications, including advanced communication systems. It is also designed to be flexible and can be used in a variety of applications, including embedded processing, digital signal processing, and image processing. Whether the application environment requires the support of new technologies depends on the specific technologies needed.
Overall, the EP20K60EFC144-1X chip is designed to provide high-performance computing capabilities while maintaining low power consumption. It is designed to meet the needs of the ever-changing technology landscape, and can be used in a variety of applications, including advanced communication systems, image processing, video processing, and communications systems. The chip also supports a variety of HDL languages, making it suitable for a variety of application scenarios.
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