Intel Corporation
EP20K60EBC356-1X
EP20K60EBC356-1X ECAD Model
EP20K60EBC356-1X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.72 ns | |
| Number of Inputs | 188 | |
| Number of Outputs | 188 | |
| Number of Logic Cells | 2560 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 196 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 196 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA-356 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP20K60EBC356-1X Datasheet Download
EP20K60EBC356-1X Overview
The chip model EP20K60EBC356-1X is a product of the current technological advancements in the semiconductor industry. This model, which is based on the EP20K architecture, is designed to provide high-performance, low-power solutions for a variety of applications. It is widely used in the fields of communication, automotive, and industrial control.
In terms of industry trends, EP20K60EBC356-1X has been widely accepted by the market and is expected to become even more popular in the future. With its high-performance, low-power design, it is well-suited for applications requiring high speed and low power consumption. It is also expected to be used in a variety of new applications, such as 5G communication systems, advanced robotics, and intelligent systems.
In terms of future development, the EP20K60EBC356-1X chip model is expected to be upgraded to provide even better performance and power consumption. It is also expected to be used in a variety of new applications, such as 5G communication systems, advanced robotics, and intelligent systems. The model can also be used to develop and popularize future intelligent robots, which will require the support of new technologies.
In order to use the EP20K60EBC356-1X chip model effectively, certain technical talents are needed. These include knowledge of the EP20K architecture, the ability to design and debug hardware and software, and the ability to integrate the chip model into a variety of applications. Furthermore, knowledge of the latest technologies, such as 5G communication systems, robotics, and artificial intelligence, is also necessary for effective use of the chip model.
In conclusion, the EP20K60EBC356-1X chip model is an advanced product of the current semiconductor industry. It is widely used in various fields and is expected to become even more popular in the future. It is also expected to be used in a variety of new applications, such as 5G communication systems, advanced robotics, and intelligent systems. In order to use the chip model effectively, certain technical talents are needed, such as knowledge of the EP20K architecture, the ability to design and debug hardware and software, and the ability to integrate the chip model into a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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