Intel Corporation
EP20K600CB652C9
EP20K600CB652C9 ECAD Model
EP20K600CB652C9 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 2 ns | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 24320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 488 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 488 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B652 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 652 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA652,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 45 X 45 MM, 1.27 MM PITCH, BGA-652 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K600CB652C9 Datasheet Download
EP20K600CB652C9 Overview
The chip model EP20K600CB652C9 is the latest in the market, and it is widely used in many industries such as automotive, consumer electronics, and medical devices. It is a low-power and high-performance field-programmable gate array (FPGA) device that features a range of features, including programmable logic, memory, and I/O. This chip model is designed to provide a reliable, cost-effective, and programmable solution for various applications.
The EP20K600CB652C9 is designed to reduce power consumption, increase performance, and improve reliability. It is also designed to be compatible with the latest technologies and standards, such as PCI Express, USB 3.0, and Ethernet. This chip model is also designed to be used in a wide range of applications, such as automotive, consumer electronics, and medical devices. Its flexibility and scalability make it suitable for many different applications.
The EP20K600CB652C9 is a powerful and reliable solution for many applications. It is easy to program and provides a wide range of features and functions. It is also designed to be compatible with the latest technologies and standards, such as PCI Express, USB 3.0, and Ethernet. The chip model is also designed to be used in a wide range of applications, such as automotive, consumer electronics, and medical devices.
In terms of industry trends, the EP20K600CB652C9 is expected to be in high demand in the coming years. Its low power consumption, high performance, and reliability make it an attractive choice for many applications. The chip model is also designed to be compatible with the latest technologies and standards, such as PCI Express, USB 3.0, and Ethernet. This makes it suitable for many different applications.
When it comes to the product description and design requirements of the EP20K600CB652C9, it is important to consider the application environment and the specific technologies that are needed. The chip model is designed to be compatible with the latest technologies and standards, such as PCI Express, USB 3.0, and Ethernet. This makes it suitable for many different applications. It is also important to consider the actual case studies and precautions when designing the chip model.
In conclusion, the chip model EP20K600CB652C9 is a powerful and reliable solution for many applications. It is designed to reduce power consumption, increase performance, and improve reliability. It is also designed to be compatible with the latest technologies and standards, such as PCI Express, USB 3.0, and Ethernet. The chip model is expected to be in high demand in the coming years, and its flexibility and scalability make it suitable for many different applications. It is important to consider the application environment and the specific technologies that are needed when designing the chip model, and to consider the actual case studies and precautions.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||