Intel Corporation
EP20K400BC652-2X
EP20K400BC652-2X ECAD Model
EP20K400BC652-2X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 3.1 ns | |
| Number of Inputs | 496 | |
| Number of Outputs | 496 | |
| Number of Logic Cells | 16640 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 502 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 502 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B652 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 652 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA652,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA-652 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K400BC652-2X Datasheet Download
EP20K400BC652-2X Overview
The chip model EP20K400BC652-2X is an advanced integrated circuit (IC) developed by Actel Corporation. It is a low-power and high-performance field-programmable gate array (FPGA) that supports the latest communication protocols and multiple interfaces. It has been widely used in the communication and industrial control sectors due to its low power consumption, high performance and ease of use.
The EP20K400BC652-2X chip model has been designed to meet the needs of the communication and industrial control sectors. It is a high-performance, low-power FPGA that supports the latest communication protocols and multiple interfaces. It has a wide range of applications, from industrial automation to communication networks. It is also widely used in the automotive industry, where it is used to control and monitor various systems.
In terms of the industry trends of the EP20K400BC652-2X chip model, it is expected that the demand for this chip model will continue to grow in the future. This is due to the increasing demand for low-power and high-performance FPGAs in the communication and industrial control sectors. In addition, the chip model is expected to be upgraded in the future to support new technologies, such as 5G and Internet of Things (IoT).
Regarding the original design intention of the EP20K400BC652-2X chip model and its possible future upgrades, the chip model was designed to meet the needs of the communication and industrial control sectors. It is expected that the chip model will be upgraded in the future to support new technologies, such as 5G and IoT. This will enable the chip model to be used in more advanced communication systems and networks.
In terms of the possible future applications of the EP20K400BC652-2X chip model, it is expected that the chip model will be used in more advanced communication systems and networks. It can also be used in intelligent scenarios, such as autonomous driving and smart home systems. Furthermore, it is expected that the chip model will be used in the era of fully intelligent systems, where it will be used to control and monitor various systems.
In conclusion, the EP20K400BC652-2X chip model is a high-performance, low-power FPGA that supports the latest communication protocols and multiple interfaces. It has been widely used in the communication and industrial control sectors due to its low power consumption, high performance and ease of use. It is expected that the demand for this chip model will continue to grow in the future, and that it will be upgraded to support new technologies. In addition, the chip model is expected to be used in more advanced communication systems and networks, as well as in intelligent scenarios and the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||