Intel Corporation
EP20K200FC484-1X
EP20K200FC484-1X ECAD Model
EP20K200FC484-1X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 2.5 ns | |
| Number of Inputs | 376 | |
| Number of Outputs | 376 | |
| Number of Logic Cells | 8320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 382 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 382 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FINE LINE, BGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K200FC484-1X Datasheet Download
EP20K200FC484-1X Overview
The EP20K200FC484-1X is a chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL (Hardware Description Language) to ensure that it is capable of meeting the demands of modern applications.
The EP20K200FC484-1X is a powerful chip model that has the potential to be used in many different scenarios. It is capable of being used in networks, allowing for the efficient transfer of data. It can also be used in intelligent scenarios, with its powerful processing capabilities allowing it to be used in the era of fully intelligent systems.
The product description and design requirements of the EP20K200FC484-1X are detailed in the accompanying documentation. It is important to note that the chip model has specific design requirements that must be met in order for it to be used effectively. This includes the use of HDL language, as well as the need for a specific design for the chip model.
Case studies can also be used to gain a better understanding of the EP20K200FC484-1X. These case studies can provide insight into how the chip model is used in practical applications, as well as the different scenarios in which it can be used. Additionally, these case studies can provide information on the precautions that must be taken when using the chip model.
In conclusion, the EP20K200FC484-1X is a powerful chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language, and can be used in networks and intelligent scenarios. The product description and design requirements of the chip model are detailed in the accompanying documentation, and case studies can be used to gain a better understanding of the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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