Intel Corporation
EP20K1500EFC1020-2X
EP20K1500EFC1020-2X ECAD Model
EP20K1500EFC1020-2X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 808 | |
| Number of Outputs | 808 | |
| Number of Logic Cells | 51840 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 808 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 808 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,2.5,3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B1020 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1020 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1020,32X32,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 33 X 33 MM, 1 MM PITCH, FINE LINE, BGA-1020 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
EP20K1500EFC1020-2X Datasheet Download
EP20K1500EFC1020-2X Overview
The chip model EP20K1500EFC1020-2X is a powerful and versatile integrated circuit designed with the latest technologies and standards. It is widely used in the field of embedded systems and communication systems, and is an important component of many devices. With its powerful functions and capabilities, it has become an indispensable part of modern technology.
To better understand the industry trends of the chip model EP20K1500EFC1020-2X and its future development, it is important to understand the original design intention of the chip. It was designed to be a low-power, high-performance, and cost-effective solution for embedded and communication systems. It is capable of providing high-speed data processing, high-speed communication, and low-power consumption, making it an ideal solution for many applications.
In terms of future upgrades, the chip model EP20K1500EFC1020-2X can be upgraded to support new technologies. It can be easily adapted to the changing needs of the application environment, allowing for faster and more efficient data processing. Additionally, the chip can be used to develop and popularize future intelligent robots, as it is capable of providing the necessary computing power and communication capabilities.
For those who wish to use the chip model EP20K1500EFC1020-2X effectively, it is important to have the necessary technical knowledge and experience. It is recommended that users have a good understanding of embedded and communication systems, as well as experience in programming. Additionally, knowledge of robotics and artificial intelligence is also beneficial, as these technologies are becoming increasingly important in the development of intelligent robots.
In conclusion, the chip model EP20K1500EFC1020-2X is a powerful and versatile integrated circuit that is capable of providing high-speed data processing and communication capabilities. It can be upgraded to support new technologies, and can be used to develop and popularize future intelligent robots. To effectively use the chip model, it is important to have the necessary technical knowledge and experience.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||