Intel Corporation
EP20K100FI324-2
EP20K100FI324-2 ECAD Model
EP20K100FI324-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 246 | |
| Number of Outputs | 246 | |
| Number of Logic Cells | 4160 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 246 | |
| Programmable Logic Type | LOADABLE PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 246 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324(UNSPEC) | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA324(UNSPEC) | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EP20K100FI324-2 Datasheet Download
EP20K100FI324-2 Overview
The chip model EP20K100FI324-2 is an integrated circuit designed for use in Field Programmable Gate Arrays (FPGAs) and other programmable logic devices. Developed by Altera Corporation, this model is a low-cost, low-power, high-density FPGA that is suitable for use in a variety of applications. It is designed to provide a high-performance, highly reliable, and easily programmable solution for customers.
EP20K100FI324-2 has been designed with a number of features that make it attractive for use in a variety of applications. It is capable of supporting up to 100K logic elements, and is suitable for use in high-performance applications such as communications, networking, and industrial automation. It also offers a low-power solution, with a typical power consumption of only 1.2W. This makes it ideal for use in portable and battery-powered devices, as well as in low-power applications. Additionally, the chip model is designed to be easy to program, with a range of programming options available.
The EP20K100FI324-2 chip model is expected to be in high demand in the future, as the demand for reliable, low-power solutions continues to grow. As more and more applications require low-power solutions, the chip model is expected to be increasingly used in a variety of applications. Additionally, the chip model is designed to be easily upgradable, allowing it to be used in emerging technologies and applications. This makes it suitable for use in advanced communication systems, as well as for use in industrial automation applications.
The EP20K100FI324-2 chip model is designed to provide a reliable, low-power solution for customers. It is capable of supporting up to 100K logic elements, is easy to program, and is suitable for use in a variety of applications. Additionally, the chip model is designed to be easily upgradable, allowing it to be used in emerging technologies and applications. As a result, the chip model is expected to be in high demand in the future, as the demand for reliable, low-power solutions continues to grow.
You May Also Be Interested In
1,658 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||