Intel Corporation
10M16SCE144C7G
10M16SCE144C7G ECAD Model
10M16SCE144C7G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3 V | |
| Number of Inputs | 101 | |
| Number of Outputs | 101 | |
| Number of Logic Cells | 16000 | |
| Number of CLBs | 1000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 1000 CLBS | |
| Additional Feature | OPERATES AT 3.3V NOMINAL VCC | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.15 V | |
| Supply Voltage-Min | 2.85 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.65 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HLFQFP, QFP144,.87SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10M16SCE144C7G Datasheet Download
10M16SCE144C7G Overview
The chip model 10M16SCE144C7G is a highly advanced integrated circuit that is designed to provide a wide range of applications for communication networks. It is designed to be used in a variety of scenarios, including in advanced communication systems. This chip model is capable of supporting the latest technologies, including the latest 5G and 6G technologies. It is also designed to be used in the era of fully intelligent systems, allowing it to be used in various intelligent scenarios.
The chip model 10M16SCE144C7G has been designed with the latest technologies in mind. It is capable of supporting the latest 5G and 6G technologies, as well as the latest technologies in the field of artificial intelligence and machine learning. It is also capable of supporting the latest network protocols, such as the latest versions of Ethernet, Wi-Fi and Bluetooth. This chip model is also capable of being used in various intelligent scenarios, such as in autonomous vehicles, smart home systems, and other intelligent scenarios.
The chip model 10M16SCE144C7G is designed to be highly reliable and efficient. It is designed to be able to withstand a wide range of environmental conditions, including extreme temperatures, humidity, and other environmental conditions. It is also designed to be highly efficient, allowing it to be used in various applications with minimal power consumption.
The chip model 10M16SCE144C7G is designed to be highly scalable, allowing it to be easily upgraded in the future. It is designed to be able to support the latest technologies, including the latest 5G and 6G technologies, as well as the latest technologies in the field of artificial intelligence and machine learning. It is also designed to be able to support the latest network protocols, such as the latest versions of Ethernet, Wi-Fi and Bluetooth. This chip model is also designed to be able to be used in various intelligent scenarios, such as in autonomous vehicles, smart home systems, and other intelligent scenarios.
The chip model 10M16SCE144C7G is designed to be highly reliable and efficient. It is designed to be able to withstand a wide range of environmental conditions, including extreme temperatures, humidity, and other environmental conditions. It is also designed to be highly efficient, allowing it to be used in various applications with minimal power consumption.
In conclusion, the chip model 10M16SCE144C7G is a highly advanced integrated circuit that is designed to provide a wide range of applications for communication networks. It is designed to be used in a variety of scenarios, including in advanced communication systems. It is capable of supporting the latest technologies, including the latest 5G and 6G technologies, as well as the latest technologies in the field of artificial intelligence and machine learning. It is also designed to be highly reliable and efficient, allowing it to be used in various applications with minimal power consumption. It is also designed to be highly scalable, allowing it to be easily upgraded in the future. This chip model is also capable of being used in various intelligent scenarios, such as in autonomous vehicles, smart home systems, and other intelligent scenarios.
You May Also Be Interested In
1,350 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||