HC1S30F780N
HC1S30F780N
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rohs

Altera Corporation

HC1S30F780N


HC1S30F780N
F53-HC1S30F780N
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA, BGA780,28X28,40
FPGA780

HC1S30F780N ECAD Model


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HC1S30F780N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Number of Inputs 597
Number of Outputs 597
Number of Logic Cells 32470
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Power Supplies 1.5,1.5/3.3 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

HC1S30F780N Overview



The chip model HC1S30F780N is a product of the latest technology in the semiconductor industry and has been widely used in various fields. It is a high-performance, low-cost, low-power, and low-temperature chip model. It is designed to meet the needs of various industries, and its performance and stability have been widely recognized.


In terms of industry trends, HC1S30F780N is widely used in the fields of communication, automotive, industrial control, and consumer electronics. With the development of 5G and the continuous improvement of communication technology, the application of HC1S30F780N will become more and more extensive. In the future, it is expected that the application of HC1S30F780N will be further extended to the field of intelligent robots.


The original design intention of the chip model HC1S30F780N is to provide a low-cost, low-power, and low-temperature solution to meet the needs of various industries. The chip model has excellent performance in terms of power consumption, temperature control, and signal transmission. In the future, it is possible to upgrade the HC1S30F780N chip model, which can meet the more stringent requirements of advanced communication systems.


In addition, the application of HC1S30F780N in the development and popularization of future intelligent robots is also possible. With the help of HC1S30F780N, the design of intelligent robots can be more efficient and accurate, and the cost can be reduced. However, in order to use the chip model effectively, certain technical talents are needed. For example, engineers need to have a certain understanding of the chip model, and be able to clearly understand the design principles, technology parameters, and performance characteristics of the chip model.


In conclusion, the chip model HC1S30F780N is a very important product in the semiconductor industry. It has excellent performance in terms of power consumption, temperature control, and signal transmission, and is widely used in various fields. In the future, it is possible to upgrade the chip model, which can meet the more stringent requirements of advanced communication systems. In addition, the application of HC1S30F780N in the development and popularization of future intelligent robots is also possible. However, certain technical talents are needed to use the chip model effectively.



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