Altera Corporation
EPM7064STC100-6
EPM7064STC100-6 ECAD Model
EPM7064STC100-6 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 68 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 68 I/O | |
| Additional Feature | 64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
| Clock Frequency-Max | 200 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, TQFP100,.63SQ | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
EPM7064STC100-6 Overview
The chip model EPM7064STC100-6 is a high-performance, low-power integrated circuit designed for digital signal processing, embedded processing, and image processing. It is capable of operating at high speeds and is suitable for a variety of applications. The chip model is programmed using HDL language, making it suitable for advanced communication systems.
The original design intention of the chip model EPM7064STC100-6 was to provide a powerful and efficient platform for digital signal processing and image processing. It is also designed to be easily upgradable, allowing users to take advantage of the latest technologies and features. This makes the chip model suitable for a wide range of applications, from high-end digital signal processing to embedded processing and image processing.
The chip model EPM7064STC100-6 is also suitable for use in networks and intelligent scenarios. It is capable of processing large amounts of data quickly and accurately, making it ideal for use in advanced communication systems. It is also capable of being used in the era of fully intelligent systems, providing a powerful platform for machine learning and artificial intelligence.
The chip model EPM7064STC100-6 is a powerful and efficient integrated circuit that is suitable for a variety of applications. It is capable of operating at high speeds and is programmed using HDL language, making it suitable for advanced communication systems. It is also designed to be easily upgradable and is suitable for use in networks and intelligent scenarios, making it an ideal choice for the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||