EPF8820BC225-3
EPF8820BC225-3
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EPF8820BC225-3


EPF8820BC225-3
F53-EPF8820BC225-3
Active
LOADABLE PLD, CMOS, BGA, BGA225,15X15
BGA, BGA225,15X15

EPF8820BC225-3 ECAD Model


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EPF8820BC225-3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 152
Number of Outputs 148
Number of Logic Cells 672
Number of Dedicated Inputs 4
Number of I/O Lines 148
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 148 I/O
Additional Feature 820 FLIP FLOPS; 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION (3.3V OR 5V)
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.3 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA, BGA225,15X15
Pin Count 225
Reach Compliance Code unknown
HTS Code 8542.39.00.01

EPF8820BC225-3 Datasheet Download


EPF8820BC225-3 Overview



The chip model EPF8820BC225-3 is an integrated circuit that has been developed by the semiconductor industry in recent years. It is widely used in various fields such as telecommunications, consumer electronics, and automotive electronics. As the development of technology continues, the chip model EPF8820BC225-3 is also constantly being improved and updated. Therefore, it is necessary to understand the industry trends of the chip model EPF8820BC225-3 and the future development of related industries.


In terms of industry trends, the chip model EPF8820BC225-3 has the advantages of high performance, low power consumption, and low cost. It is expected that the chip model EPF8820BC225-3 will be used in more and more fields in the future. For example, it can be used in the development of intelligent robots, which will be widely used in the near future. In addition, it can also be applied to the development of networks and intelligent scenarios, which are becoming more and more popular.


In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. Generally speaking, the chip model EPF8820BC225-3 can support a variety of technologies, such as artificial intelligence, machine learning, and big data. Therefore, the chip model EPF8820BC225-3 can be used to develop and popularize future intelligent robots. Moreover, it can also be used to develop and deploy intelligent scenarios in various fields.


In order to use the chip model EPF8820BC225-3 effectively, certain technical talents are needed. For example, one needs to have a good understanding of the chip model EPF8820BC225-3, as well as the knowledge of the related technologies. In addition, one also needs to have the ability to develop and deploy applications with the chip model EPF8820BC225-3. Therefore, it is necessary for the technical personnel who want to use the chip model EPF8820BC225-3 to have a certain level of technical knowledge and skills.


In conclusion, the chip model EPF8820BC225-3 is an important integrated circuit developed by the semiconductor industry. It has the advantages of high performance, low power consumption, and low cost, and it is expected to be widely used in various fields in the future. In order to use the chip model EPF8820BC225-3 effectively, certain technical talents are needed. Therefore, it is necessary to understand the industry trends of the chip model EPF8820BC225-3 and the future development of related industries.



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