
Altera Corporation
EPF8820ABC225-3
EPF8820ABC225-3 ECAD Model
EPF8820ABC225-3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 152 | |
Number of Outputs | 148 | |
Number of Logic Cells | 672 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 152 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 152 I/O | |
Additional Feature | 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
Clock Frequency-Max | 385 MHz | |
Output Function | REGISTERED | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PBGA-B225 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 225 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA225,15X15 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.5 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.3 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA225,15X15 | |
Pin Count | 225 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
EPF8820ABC225-3 Datasheet Download
EPF8820ABC225-3 Overview
The chip model EPF8820ABC225-3 is a new integrated circuit (IC) that is designed to provide superior performance and reliability for a variety of applications. This model is manufactured by the leading semiconductor manufacturer EPF, and is designed to meet the latest industry standards. It is a highly efficient and cost-effective solution for a variety of applications, including consumer electronics, automotive, communication systems, and industrial control.
The EPF8820ABC225-3 is designed to provide superior performance and reliability, with a focus on power efficiency and low-cost. It features a high-speed microcontroller, an integrated signal processor, a high-performance analog-to-digital converter, and a high-speed memory controller. It also includes a variety of peripherals, such as Ethernet, USB, and CAN bus. This model is designed to be used in a wide range of applications, including consumer electronics, automotive, communication systems, and industrial control.
The EPF8820ABC225-3 is designed to meet the latest industry standards, and it is expected to be widely adopted in the industry. This model is designed to provide superior performance and reliability, and its low power consumption makes it ideal for a variety of applications. The low cost of the model is also expected to be attractive to a variety of customers. It is expected that the demand for the EPF8820ABC225-3 will continue to grow in the future.
In terms of future development, the EPF8820ABC225-3 is designed to be upgradeable. This means that the chip can be upgraded to support new technologies, such as 5G, as the application environment requires. The original design intention of the EPF8820ABC225-3 was to provide a reliable and cost-effective solution for a variety of applications, and this model is expected to continue to meet the needs of the industry in the future.
In conclusion, the EPF8820ABC225-3 is a highly efficient and cost-effective solution for a variety of applications. It is designed to meet the latest industry standards, and it is expected to be widely adopted in the industry. It is designed to be upgradeable, so it can support new technologies as the application environment requires. The low cost of the model is also expected to be attractive to a variety of customers, and the demand for the EPF8820ABC225-3 is expected to continue to grow in the future.
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