EPF8820ABC225-3
EPF8820ABC225-3
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rohs

Altera Corporation

EPF8820ABC225-3


EPF8820ABC225-3
F53-EPF8820ABC225-3
Active
LOADABLE PLD, CMOS, BGA, BGA225,15X15
BGA, BGA225,15X15

EPF8820ABC225-3 ECAD Model


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EPF8820ABC225-3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 152
Number of Outputs 148
Number of Logic Cells 672
Number of Dedicated Inputs 4
Number of I/O Lines 152
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 152 I/O
Additional Feature 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 385 MHz
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.3 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA, BGA225,15X15
Pin Count 225
Reach Compliance Code unknown
HTS Code 8542.39.00.01

EPF8820ABC225-3 Datasheet Download


EPF8820ABC225-3 Overview



The chip model EPF8820ABC225-3 is a new integrated circuit (IC) that is designed to provide superior performance and reliability for a variety of applications. This model is manufactured by the leading semiconductor manufacturer EPF, and is designed to meet the latest industry standards. It is a highly efficient and cost-effective solution for a variety of applications, including consumer electronics, automotive, communication systems, and industrial control.


The EPF8820ABC225-3 is designed to provide superior performance and reliability, with a focus on power efficiency and low-cost. It features a high-speed microcontroller, an integrated signal processor, a high-performance analog-to-digital converter, and a high-speed memory controller. It also includes a variety of peripherals, such as Ethernet, USB, and CAN bus. This model is designed to be used in a wide range of applications, including consumer electronics, automotive, communication systems, and industrial control.


The EPF8820ABC225-3 is designed to meet the latest industry standards, and it is expected to be widely adopted in the industry. This model is designed to provide superior performance and reliability, and its low power consumption makes it ideal for a variety of applications. The low cost of the model is also expected to be attractive to a variety of customers. It is expected that the demand for the EPF8820ABC225-3 will continue to grow in the future.


In terms of future development, the EPF8820ABC225-3 is designed to be upgradeable. This means that the chip can be upgraded to support new technologies, such as 5G, as the application environment requires. The original design intention of the EPF8820ABC225-3 was to provide a reliable and cost-effective solution for a variety of applications, and this model is expected to continue to meet the needs of the industry in the future.


In conclusion, the EPF8820ABC225-3 is a highly efficient and cost-effective solution for a variety of applications. It is designed to meet the latest industry standards, and it is expected to be widely adopted in the industry. It is designed to be upgradeable, so it can support new technologies as the application environment requires. The low cost of the model is also expected to be attractive to a variety of customers, and the demand for the EPF8820ABC225-3 is expected to continue to grow in the future.



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