Altera Corporation
EPF81500RC304-3
EPF81500RC304-3 ECAD Model
EPF81500RC304-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 208 | |
| Number of Outputs | 204 | |
| Number of Logic Cells | 1296 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 204 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 204 I/O | |
| Additional Feature | 1500 FLIP FLOPS; 1296 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION (3.3V OR 5V) | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G304 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 304 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP304,1.7SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 4.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP304,1.7SQ,20 | |
| Pin Count | 304 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF81500RC304-3 Datasheet Download
EPF81500RC304-3 Overview
The chip model EPF81500RC304-3 is a powerful and versatile component in the world of microprocessors. It is a field-programmable gate array (FPGA) that can be used to implement a variety of digital logic functions. It has been developed by Altera Corporation, a leading provider of programmable logic solutions.
This chip model is suitable for a wide range of applications, such as communication systems, embedded systems, and automotive systems. It is also capable of being used in industrial automation and robotics, as well as in the Internet of Things (IoT). It has a high-performance architecture that allows it to be used in a variety of applications.
The EPF81500RC304-3 is designed to be easily upgradeable and can be used in both existing and future applications. It is capable of being used in advanced communication systems, such as 5G networks and beyond. It is also capable of being used in intelligent scenarios, such as artificial intelligence (AI) and machine learning (ML). It is a powerful and versatile component that can be used to build high-performance communication systems.
In addition, the EPF81500RC304-3 has the capability to be used in the era of fully intelligent systems. This chip model is designed to be compatible with a range of new technologies, such as AI and ML. It is capable of being used in a variety of intelligent scenarios, such as autonomous vehicles and smart homes. It is also capable of being used in the Internet of Things, allowing it to be used in a variety of applications.
Overall, the EPF81500RC304-3 is a powerful and versatile chip model that has been designed to be upgradeable and compatible with a range of new technologies. It is capable of being used in a variety of applications, such as communication systems, embedded systems, and automotive systems. It is also capable of being used in intelligent scenarios, such as AI and ML, as well as in the Internet of Things. It is an ideal component for building high-performance communication systems in the era of fully intelligent systems.
1,870 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||