Altera Corporation
EPF81500ARI304-3
EPF81500ARI304-3 ECAD Model
EPF81500ARI304-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 1.8 ns | |
| Number of Inputs | 208 | |
| Number of Outputs | 204 | |
| Number of Logic Cells | 1296 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 208 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 208 I/O | |
| Additional Feature | CAN ALSO OPERATE AT 5V SUPPLY | |
| Clock Frequency-Max | 385 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G304 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 304 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP304,1.7SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 4.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | HFQFP, HQFP304,1.7SQ,20 | |
| Pin Count | 304 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF81500ARI304-3 Datasheet Download
EPF81500ARI304-3 Overview
The chip model EPF81500ARI304-3 is an integrated circuit designed by Altera Corporation, now part of Intel. This chip is designed for high-speed communications, and has been used in many applications such as cellular, satellite, and wireless systems. It is a powerful tool for communication systems and provides a wide range of features.
The industry trends of the chip model EPF81500ARI304-3 are constantly changing. With the development of new technologies, the chip may be used in more advanced communication systems. The original design intention of the chip model EPF81500ARI304-3 is to provide a high-speed, low-power solution for communication systems. The chip is also equipped with a wide range of features, such as a high-speed transceiver, a digital signal processor, and a high-speed memory controller.
The chip model EPF81500ARI304-3 is also capable of being upgraded in the future. It is possible to add new features to the chip, such as higher speed transceivers, more powerful digital signal processors, and more efficient memory controllers. These upgrades would enable the chip to be used in more advanced communication systems.
The chip model EPF81500ARI304-3 has the potential to be used in networks and intelligent scenarios. It is possible to use the chip in networks to enable faster data transfer and more efficient communication. Furthermore, the chip can be used in intelligent scenarios, such as in the era of fully intelligent systems. The chip can be used to provide faster data processing and more efficient communication.
In conclusion, the chip model EPF81500ARI304-3 has a wide range of features and can be used in a variety of applications. It is capable of being upgraded in the future and can be used in networks and intelligent scenarios. Whether the application environment requires the support of new technologies depends on what specific technologies are needed. The chip model EPF81500ARI304-3 is a powerful tool for communication systems and has the potential to be used in the era of fully intelligent systems.
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