Altera Corporation
EPF10K30EFC484-3N
EPF10K30EFC484-3N ECAD Model
EPF10K30EFC484-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 220 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K30EFC484-3N Overview
The chip model EPF10K30EFC484-3N is a high-performance integrated circuit (IC) designed for a variety of applications. This IC is based on the popular field programmable gate array (FPGA) technology and has been used in a wide range of products, from consumer electronics to industrial systems. It is a cost-effective solution for many applications and has been widely adopted by manufacturers.
In terms of industry trends, the EPF10K30EFC484-3N is a mature technology and is expected to remain popular in the near future. However, the technological landscape is constantly changing and the chip model may need to be upgraded in order to remain competitive. In particular, the EPF10K30EFC484-3N may need to be designed to support new technologies such as 5G, artificial intelligence (AI), and the Internet of Things (IoT).
The EPF10K30EFC484-3N is also suitable for use in advanced communication systems. Its original design intention was to provide a cost-effective solution for many applications, and it is capable of supporting a wide range of protocols and standards. This makes it an ideal choice for a variety of communication systems, including cellular networks, wireless networks, and satellite networks.
In terms of future applications, the EPF10K30EFC484-3N can be used in a variety of networks, ranging from small local networks to large-scale networks. It can also be used in intelligent scenarios, such as smart homes, smart cities, and autonomous vehicles. In the era of fully intelligent systems, the EPF10K30EFC484-3N is capable of providing the necessary support for a variety of applications.
In conclusion, the chip model EPF10K30EFC484-3N is a mature technology that is expected to remain popular in the near future. It is cost-effective and suitable for a variety of applications, including advanced communication systems, networks, and intelligent scenarios. It is also capable of supporting new technologies such as 5G, AI, and IoT, making it an ideal choice for the era of fully intelligent systems.
3,266 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||