Altera Corporation
EP2SGX90FF1508I3N
EP2SGX90FF1508I3N ECAD Model
EP2SGX90FF1508I3N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 650 | |
| Number of Outputs | 650 | |
| Number of Logic Cells | 90960 | |
| Number of CLBs | 90960 | |
| Combinatorial Delay of a CLB-Max | 2.99 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 90960 CLBS | |
| Clock Frequency-Max | 622.08 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B1508 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 1508 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1508,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, LEAD FREE, FBGA-1508 | |
| Pin Count | 1508 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2SGX90FF1508I3N Datasheet Download
EP2SGX90FF1508I3N Overview
The chip model EP2SGX90FF1508I3N has become increasingly popular in the industry due to its wide range of features and capabilities. It is a highly advanced, high-performance system-on-chip (SoC) that can be used for a variety of applications. It is designed to provide a cost-effective solution for applications that require high performance, low power consumption, and low cost.
The EP2SGX90FF1508I3N chip model offers a wide range of features and capabilities. It is designed to support a wide range of technologies, including high-speed DDR3 memory, high-speed USB 3.0, and high-speed Ethernet. It also supports a variety of multimedia formats, including H.264, MPEG-2, and AVC. Additionally, it is capable of supporting advanced graphics, including OpenGL ES 3.0, OpenCL, and OpenVG.
The EP2SGX90FF1508I3N chip model is designed to provide high performance and low power consumption. It is designed to be highly efficient and to provide a cost-effective solution for applications that require high performance and low power consumption. Additionally, it is designed to be compatible with a wide range of operating systems, including Linux, Windows, and Android.
The EP2SGX90FF1508I3N chip model is expected to be in high demand in the future due to its wide range of features and capabilities. It is expected to be used in a variety of applications, including mobile devices, automotive systems, and embedded systems. Additionally, it is expected to be used in a variety of industries, including consumer electronics, automotive, and industrial automation.
The EP2SGX90FF1508I3N chip model is designed to meet the specific needs of the application environment. It is designed to be compatible with a wide range of technologies, including high-speed DDR3 memory, high-speed USB 3.0, and high-speed Ethernet. Additionally, it is designed to be compatible with a wide range of operating systems, including Linux, Windows, and Android.
In order to ensure that the EP2SGX90FF1508I3N chip model is properly utilized, it is important to understand the product description and design requirements of the model. Additionally, it is important to understand the potential applications of the model and the potential risks associated with using the model. Additionally, it is important to understand the potential benefits of using the model and the potential risks associated with using the model.
Finally, it is important to consider actual case studies and precautions when utilizing the EP2SGX90FF1508I3N chip model. By understanding the product description, design requirements, potential applications, and potential risks associated with the model, it is possible to ensure that the model is used in the best possible way. Additionally, by understanding the potential benefits of using the model and the potential risks associated with using the model, it is possible to ensure that the model is used in the most efficient and cost-effective manner.
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4,458 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $991.9974 | $991.9974 |
| 10+ | $981.3308 | $9,813.3079 |
| 100+ | $927.9976 | $92,799.7593 |
| 1000+ | $874.6644 | $437,332.1990 |
| 10000+ | $799.9979 | $799,997.9250 |
| The price is for reference only, please refer to the actual quotation! | ||