Altera Corporation
EP2SGX90EF1152I3
EP2SGX90EF1152I3 ECAD Model
EP2SGX90EF1152I3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 558 | |
| Number of Outputs | 558 | |
| Number of Logic Cells | 90960 | |
| Number of CLBs | 90960 | |
| Combinatorial Delay of a CLB-Max | 2.99 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 90960 CLBS | |
| Clock Frequency-Max | 622.08 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1152 |
EP2SGX90EF1152I3 Datasheet Download
EP2SGX90EF1152I3 Overview
The chip model EP2SGX90EF1152I3 is an advanced multi-core processor with a high level of integration and flexibility, making it suitable for a wide range of applications. It is especially suited for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The EP2SGX90EF1152I3 chip model provides a number of advantages over other models, including enhanced performance, lower power consumption, and improved scalability. It is also designed to be compatible with a variety of operating systems, making it suitable for a wide range of applications. Additionally, its high-speed memory interface allows for efficient data transfer and processing, making it ideal for applications that require high-speed data processing.
The EP2SGX90EF1152I3 chip model is expected to be in high demand in the future, especially in the field of digital signal processing, embedded processing, and image processing. The chip model is also expected to be in demand for applications that require the support of new technologies, such as machine learning, artificial intelligence, and virtual reality.
The EP2SGX90EF1152I3 chip model is an ideal choice for companies looking to upgrade their existing systems or develop new applications. Its advanced features, low power consumption, and scalability make it a great choice for businesses looking to stay ahead of the curve. With its ability to support a wide range of technologies, the EP2SGX90EF1152I3 chip model is expected to be in high demand in the future and will likely be an important component of many businesses’ technology infrastructure.
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2,715 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,447.0800 | $1,447.0800 |
| 10+ | $1,431.5200 | $14,315.2000 |
| 100+ | $1,353.7200 | $135,372.0000 |
| 1000+ | $1,275.9200 | $637,960.0000 |
| 10000+ | $1,167.0000 | $1,167,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||