EP20K200EBI652-3
EP20K200EBI652-3
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rohs

Altera Corporation

EP20K200EBI652-3


EP20K200EBI652-3
F53-EP20K200EBI652-3
Active
LOADABLE PLD, CMOS, LBGA, BGA652,35X35,50
LBGA, BGA652,35X35,50

EP20K200EBI652-3 ECAD Model


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EP20K200EBI652-3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 368
Number of Outputs 368
Number of Logic Cells 8320
Number of Dedicated Inputs 4
Number of I/O Lines 376
Programmable Logic Type LOADABLE PLD
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 376 I/O
Output Function MACROCELL
Power Supplies 1.8,1.8/3.3 V
JESD-30 Code S-PBGA-B652
Qualification Status Not Qualified
JESD-609 Code e1
Peak Reflow Temperature (Cel) 220
Number of Terminals 652
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA652,35X35,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 1.63 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description LBGA, BGA652,35X35,50
Pin Count 652
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EP20K200EBI652-3 Datasheet Download


EP20K200EBI652-3 Overview



The chip model EP20K200EBI652-3 is a high-end integrated circuit (IC) designed to provide advanced processing capabilities to a wide range of applications. It is a field programmable gate array (FPGA) with a capacity of 20K gates and an operating frequency of 200MHz. This chip model has a wide range of advantages, including high performance, low power consumption, and scalability.


The EP20K200EBI652-3 chip model is expected to be in high demand in the near future, especially in the fields of industrial automation, robotics, and artificial intelligence (AI). Its high performance and low power consumption make it an ideal choice for these industries. The chip model is also suitable for use in networks, allowing for faster data transmission and better security. It can also be used for intelligent scenarios, such as facial recognition, voice recognition, and natural language processing.


The EP20K200EBI652-3 chip model has specific design requirements that must be met in order to ensure optimal performance. For example, the chip requires a minimum operating voltage of 1.2V and a maximum junction temperature of 125°C. Additionally, the chip must be able to operate at a frequency of 200MHz and be able to support up to 20K gates.


In order to ensure the successful implementation of the EP20K200EBI652-3 chip model, there are some precautions that should be taken. For example, the chip should be handled with care and not exposed to extreme temperatures. Additionally, the chip should be tested extensively before being used in any application. Finally, the chip should be properly installed and maintained in order to ensure its optimal performance.


The EP20K200EBI652-3 chip model has already been successfully implemented in several case studies. For example, it has been used in an AI-based facial recognition system for security purposes. Additionally, it has been used in a voice recognition system for customer service applications. These case studies demonstrate the potential of the EP20K200EBI652-3 chip model and its ability to be used in a variety of intelligent scenarios.


In conclusion, the EP20K200EBI652-3 chip model is a powerful and efficient FPGA with a wide range of advantages. It is expected to be in high demand in the near future, especially in the fields of industrial automation, robotics, and AI. It is suitable for use in networks and intelligent scenarios, and has already been successfully implemented in several case studies. However, certain design requirements and precautions must be taken in order to ensure optimal performance.



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