Altera Corporation
EP1C4F400I8
EP1C4F400I8 ECAD Model
EP1C4F400I8 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 400 | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Pitch | 1 mm | |
| Length | 21 mm | |
| Seated Height-Max | 2.2 mm | |
| Width | 21 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA400,20X20,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 400 | |
| Clock Frequency-Max | 275 MHz | |
| JESD-30 Code | S-PBGA-B400 | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 400 | |
| Number of Inputs | 301 | |
| Number of Logic Cells | 4000 | |
| Number of Outputs | 301 | |
| Organization | 400 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA400,20X20,40 | |
| Peak Reflow Temperature (Cel) | 220 | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM |
EP1C4F400I8 Datasheet Download
EP1C4F400I8 Overview
Chip model EP1C4F400I8 is a powerful tool for the development of modern systems. It is an application-specific integrated circuit (ASIC) designed for high-performance embedded systems, such as those used in industrial and automotive applications. This chip model is a high-density, low-power, and low-cost solution that provides a wide range of features and capabilities. It is designed to meet the needs of embedded applications, such as industrial control, automotive, and communication systems.
The chip model EP1C4F400I8 is designed with a variety of features and capabilities that make it suitable for a wide range of applications. It has a high-performance ARM Cortex-M4 processor core, which enables it to run complex applications and processes quickly and efficiently. It also has a range of interfaces and peripherals, such as Ethernet, USB, CAN, and SPI, that enable it to be used for a variety of communication and control applications. Additionally, the chip model has an integrated FPGA that can be used for custom logic and I/O.
The chip model EP1C4F400I8 is expected to be in high demand in the future, as more and more embedded applications are developed. It is expected to be used in a variety of industries, such as automotive, industrial, and communication. It is also expected to be used in a variety of applications, such as industrial control, automotive, and communication systems. Additionally, it is expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation.
In the era of fully intelligent systems, the chip model EP1C4F400I8 is expected to be used in a variety of applications, such as networks, autonomous vehicles, and smart homes. It is expected to be used in networks to enable communication between devices, as well as to provide security and control. Additionally, it is expected to be used in autonomous vehicles to enable the vehicle to make autonomous decisions and to control its own movements. Finally, it is expected to be used in smart homes to enable the automation of various tasks, such as lighting, climate control, and security.
Overall, the chip model EP1C4F400I8 is a powerful and cost-effective solution for embedded applications. It is expected to be in high demand in the future and is expected to be used in a variety of applications, such as networks, autonomous vehicles, and smart homes. Additionally, it is expected to be used in the era of fully intelligent systems, enabling the development of more advanced and efficient systems.
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|---|---|---|
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