AMD Xilinx
XQVR600-4CB228M
XQVR600-4CB228M ECAD Model
XQVR600-4CB228M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-CQFP-F228 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Total Dose | 100k Rad(Si) V | |
| Number of Terminals | 228 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | QFP228(UNSPEC) | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 39.37 mm | |
| Length | 39.37 mm | |
| Seated Height-Max | 3.302 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | CERAMIC, QFP-228 | |
| Pin Count | 228 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 9A515.E.2 | |
| HTS Code | 8542.39.00.01 |
XQVR600-4CB228M Datasheet Download
XQVR600-4CB228M Overview
The chip model XQVR600-4CB228M is a powerful and advanced model that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it an ideal choice for those who need a powerful and reliable chip.
The industry trends of the chip model XQVR600-4CB228M and the future development of related industries depend on what specific technologies are needed. For example, new technologies such as artificial intelligence, machine learning, and 5G networks may be needed in order to make the most of the chip model's capabilities.
The possible future applications of the chip model XQVR600-4CB228M in networks and which intelligent scenarios it may be applied to depend on the specific technologies being used. For example, the chip model may be used for facial recognition, object tracking, and other intelligent tasks. In addition, it can also be used in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and smart cities.
In conclusion, the chip model XQVR600-4CB228M is a powerful and advanced model that is suitable for a variety of applications. It requires the use of HDL language, making it an ideal choice for those who need a powerful and reliable chip. The future development of the chip model and related industries depend on what specific technologies are needed, and the chip model can be used for a variety of intelligent tasks and applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||